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MK53732F

STMicroelectronics

MK53732F by STMicroelectronics

STMicroelectronics' MK53732F is a Telephone Line IC with 18 terminals in an IN-LINE package. Operating at -30 to 60 °C, it uses CMOS technology and requires 3/5V power supply. The IC's crystal frequency is 3.58MHz, making it suitable for telephone line applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Legend Electronics Inc.

USA . 17,125 parts In-Stock

1+ parts

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17,125

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Vyrian

USA . 3,250 parts In-Stock

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3,250

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Digiode

USA . 2,475 parts In-Stock

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2,475

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Anansix

USA . 1,314 parts In-Stock

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1,314

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Odintec Ltd.

Israel . 42 parts In-Stock

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42

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Cyclops Electronics Ltd

UK . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 584 parts In-Stock

1+ parts

$10.841

100+ parts

-

1k+ parts

$9.757

10k+ parts

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584

$10.841

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$9.757

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MKK Technologies

India . 2,061 parts In-Stock

1+ parts

$20.386

100+ parts

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2,061

$20.386

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DigiPath Technology Company

USA . 2,061 parts In-Stock

1+ parts

$20.386

100+ parts

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2,061

$20.386

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Parana Technologies

USA . 895 parts In-Stock

1+ parts

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100+ parts

$12.962

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895

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$12.962

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Infinite Electronics LLP (Excess)

. 395 parts In-Stock

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395

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Corphita

USA . 87 parts In-Stock

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87

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Overview

Upgrade your telephone systems with the MK53732F by STMicroelectronics, a top-quality Telephone Line IC that promises unmatched performance and reliability. Manufactured by industry leader STMicroelectronics, this product is designed to meet the highest standards in telecommunications technology. With applications in various communication devices, this IC offers customers exceptional value, enhanced functionality, and seamless integration. Experience the benefits of crystal-clear sound quality, efficient power management, and easy installation with the MK53732F. Elevate your communication experience today with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement in various electronic devices.

Power Supplies (V): 3/5

Support for multiple power supplies allows flexibility in a variety of applications.

No. of Terminals: 18

Sufficient number of terminals for connecting to other components in a telephone line system.

Maximum Operating Temperature: 60 °C

High maximum operating temperature ensures reliable performance even in warm environments.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows the product to function in cold conditions as well.

Terminal Finish: TIN LEAD

Tin lead finish provides good electrical conductivity and solderability for secure connections.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: THROUGH-HOLE

Through-hole terminals make it easy to solder and secure the component onto a circuit board.

Crystal Frequency (MHz): 3.58

Crystal frequency of 3.58 MHz ensures accurate timing and signal processing in telephone line applications.

Technical Specifications

Telephone Line ICs MK53732F attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e0

No. of Terminals:

18

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.0006 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MK53732F Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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