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TCM1512P

Texas Instruments

TCM1512P by Texas Instruments

Texas Instruments TCM1512P is a Telephone Line IC with BICMOS technology. It has 8 terminals in an IN-LINE package, operating from -20°C to 70°C. Ideal for commercial applications requiring dual terminal position and 2.54mm pitch through-hole mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,644 parts In-Stock

1+ parts

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7,644

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Digiode

USA . 821 parts In-Stock

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821

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Cyclops Electronics Ltd

UK . 349 parts In-Stock

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349

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Component Sense

UK . 78 parts In-Stock

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78

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Distributors (Availability)

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AZTECH Wire

Italy . 290 parts In-Stock

1+ parts

$6.130

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290

$6.130

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Parana Technologies

USA . 415 parts In-Stock

1+ parts

$12.480

100+ parts

-

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$12.920

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415

$12.480

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$12.920

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DigiPath Technology Company

USA . 1,767 parts In-Stock

1+ parts

$13.742

100+ parts

$12.642

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1,767

$13.742

$12.642

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ChromeModa Solutions

Germany . 4,531 parts In-Stock

1+ parts

$14.022

100+ parts

$11.498

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4,531

$14.022

$11.498

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IDEA Electronic Components Group

UK . 512 parts In-Stock

1+ parts

$14.022

100+ parts

$13.321

1k+ parts

$12.620

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512

$14.022

$13.321

$12.620

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One Stop Electronics

USA . 1,348 parts In-Stock

1+ parts

$418.000

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1,348

$418.000

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Corphita

USA . 4,634 parts In-Stock

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4,634

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A-Z Elektronik GmbH

Germany . 3,300 parts In-Stock

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3,300

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 349 parts In-Stock

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349

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Assy Fe

Spain . 8 parts In-Stock

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8

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Overview

Upgrade your telephone line technology with the TCM1512P by Texas Instruments. With a reputation for high-quality manufacturing, Texas Instruments delivers reliable products that exceed industry standards. The TCM1512P is a versatile Telephone Line IC suitable for a range of applications, providing customers with enhanced performance and efficiency. Experience the value and benefits of this innovative product, designed to meet your communication needs with ease and precision. Trust Texas Instruments to elevate your telecommunications experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the IC, making it durable and reliable for long-term use.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space, making it easy to integrate into various electronic devices.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the IC to other components, enabling a wide range of functionality.

Package Style (Meter): IN-LINE

The in-line package style is convenient for installation and maintenance, as it allows for easy connection in a straight line.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures that the IC remains functional even in cold environments, increasing its versatility.

Terminal Position: DUAL

The dual terminal position allows for multiple connection options, enhancing the flexibility and usability of the IC.

Temperature Grade: COMMERCIAL

Being rated for commercial use ensures that this IC meets industry standards for reliability and performance in everyday applications.

Technology: BICMOS

The BICMOS technology used in this IC combines the advantages of both bipolar and CMOS technologies, resulting in improved speed, power efficiency, and noise immunity.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and provides strong mechanical connections, leading to a more robust end product.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy PCB layout and compatibility with standard connectors, facilitating integration into various electronic systems.

Technical Specifications

Telephone Line ICs TCM1512P attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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