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TCM1520ADR

Texas Instruments

TCM1520ADR by Texas Instruments

TCM1520ADR by Texas Instruments is a Telephone Line IC with 8 terminals, BICMOS technology, and 40/150V power supplies. It is used in telecom circuits for industrial applications due to its -40 to 85°C operating temperature range and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,343 parts In-Stock

1+ parts

-

100+ parts

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9,343

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Digiode

USA . 3,809 parts In-Stock

1+ parts

-

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3,809

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,024 parts In-Stock

1+ parts

$9.135

100+ parts

-

1k+ parts

$9.785

10k+ parts

-

1,024

$9.135

-

$9.785

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DigiPath Technology Company

USA . 614 parts In-Stock

1+ parts

$10.059

100+ parts

$9.254

1k+ parts

-

10k+ parts

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614

$10.059

$9.254

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ChromeModa Solutions

Germany . 3,903 parts In-Stock

1+ parts

$10.264

100+ parts

$8.416

1k+ parts

-

10k+ parts

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3,903

$10.264

$8.416

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IDEA Electronic Components Group

UK . 428 parts In-Stock

1+ parts

$10.264

100+ parts

$9.751

1k+ parts

$9.238

10k+ parts

-

428

$10.264

$9.751

$9.238

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AZTECH Wire

Italy . 643 parts In-Stock

1+ parts

$13.608

100+ parts

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643

$13.608

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One Stop Electronics

USA . 1,397 parts In-Stock

1+ parts

$509.000

100+ parts

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1,397

$509.000

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Corphita

USA . 240 parts In-Stock

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240

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Overview

Upgrade your telecom systems with the TCM1520ADR by Texas Instruments, a top-quality telephone line IC that promises reliability and efficiency. With a reputation for excellence, Texas Instruments delivers cutting-edge technology in a compact rectangular package. Ideal for industrial applications, this telecom circuit offers maximum operating temperatures of 85°C and dual-terminal positions for optimal performance. Stay connected with ease and confidence with the TCM1520ADR, where innovation meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Power Supplies (V): 40/150

Wide power supply range of 40-150V provides flexibility in different operating environments and ensures reliable performance.

No. of Terminals: 8

Ample number of terminals allow for connectivity with various external components, enabling versatile functionality.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures stability and reliability even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for operation in cold environments without compromising performance.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Maximum Supply Current: 0.0016 mA

Low maximum supply current of 0.0016 mA reduces power consumption and extends battery life in battery-powered applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance and reliability in telecommunication systems.

Technical Specifications

Telephone Line ICs TCM1520ADR attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

40/150

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0016 mA

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TCM1520ADR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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