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TCM5092N

Texas Instruments

TCM5092N by Texas Instruments

Texas Instruments TCM5092N is a Telephone Line IC with 16 terminals in an IN-LINE package. Operating at -30 to 70°C, it requires 3.5-10V power supply and draws max 10mA current. Ideal for telecommunication applications due to its CMOS technology and crystal frequency of 3.58MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,682 parts In-Stock

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1,682

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Vyrian

USA . 560 parts In-Stock

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560

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Corel Iberica Componentes, S.L.

Spain . 9 parts In-Stock

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9

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Distributors (Availability)

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AZTECH Wire

Italy . 231 parts In-Stock

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$6.835

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231

$6.835

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Parana Technologies

USA . 1,477 parts In-Stock

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$13.621

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$14.120

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1,477

$13.621

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$14.120

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ChromeModa Solutions

Germany . 2,472 parts In-Stock

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$15.304

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$12.549

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2,472

$15.304

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IDEA Electronic Components Group

UK . 1,848 parts In-Stock

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$15.304

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$14.539

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$13.774

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1,848

$15.304

$14.539

$13.774

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One Stop Electronics

USA . 651 parts In-Stock

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$347.000

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651

$347.000

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DigiPath Technology Company

USA . 983 parts In-Stock

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$13.798

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983

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$13.798

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Corphita

USA . 837 parts In-Stock

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837

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Assy Fe

Spain . 9 parts In-Stock

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Overview

Enhance your communication systems with the TCM5092N by Texas Instruments, a top-quality Telephone Line IC that offers reliability and efficiency. Manufactured by a trusted industry leader, this product is perfect for various applications in telecommunications. With its durable construction and advanced technology, customers can expect seamless performance and improved functionality. Trust Texas Instruments to deliver innovation and value with the TCM5092N, providing you with the competitive edge you need in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Power Supplies (V): 3.5/10

Wide range of power supplies allows for flexibility in different voltage requirements.

No. of Terminals: 16

Sufficient number of terminals for connecting various components and peripherals.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even in hot environments.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows the product to function in extremely cold conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall efficiency of the product.

Maximum Supply Current: 10 mA

Low maximum supply current helps in reducing power consumption and increasing the product's energy efficiency.

Technical Specifications

Telephone Line ICs TCM5092N attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.5/10

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

10 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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