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TCM5087DR

Texas Instruments

TCM5087DR by Texas Instruments

TCM5087DR by Texas Instruments is a Telephone Line IC in a small outline package with 16 terminals. It operates on 3.5-10V power supply, CMOS technology, and has a crystal frequency of 3.58MHz. Ideal for telecommunication applications due to its dual terminal position and low supply current of 0.01mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,955 parts In-Stock

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4,955

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Digiode

USA . 2,844 parts In-Stock

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2,844

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Semi Source

USA . 869 parts In-Stock

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869

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,074 parts In-Stock

1+ parts

$12.027

100+ parts

-

1k+ parts

$12.433

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2,074

$12.027

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$12.433

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DigiPath Technology Company

USA . 831 parts In-Stock

1+ parts

$13.243

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$12.183

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831

$13.243

$12.183

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ChromeModa Solutions

Germany . 6,796 parts In-Stock

1+ parts

$13.513

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$11.081

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6,796

$13.513

$11.081

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IDEA Electronic Components Group

UK . 1,316 parts In-Stock

1+ parts

$13.513

100+ parts

$12.837

1k+ parts

$12.162

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1,316

$13.513

$12.837

$12.162

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AZTECH Wire

Italy . 770 parts In-Stock

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$18.801

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770

$18.801

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One Stop Electronics

USA . 491 parts In-Stock

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$326.000

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491

$326.000

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Corphita

USA . 420 parts In-Stock

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420

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Overview

Upgrade your telephone line systems with the TCM5087DR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. Ideal for various applications in the Telephone Line ICs category, this product offers unmatched value, benefits, and advantages to customers. With a durable plastic/epoxy package body, surface mount capability, and dual terminal position, the TCM5087DR ensures optimal performance even in extreme temperatures. Trust Texas Instruments to deliver cutting-edge technology for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and protects the internal components of the IC, making it suitable for long term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easily compatible with standard PCB layouts, enhancing versatility.

Power Supplies (V): 3.5/10

Support for a range of power supplies from 3.5V to 10V provides flexibility in various applications and environments.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functions, making the IC suitable for complex telephone line setups.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables high-density mounting, particularly beneficial in compact designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the IC can function reliably in various operating conditions without overheating.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30°C ensures the IC remains functional even in cold environments.

Terminal Position: DUAL

Dual terminal positions offer redundancy and improved connectivity, enhancing reliability and signal transmission.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring efficient performance in telephone line applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and connection on the PCB, ensuring a reliable electrical connection.

Maximum Supply Current: 0.01 mA

Low maximum supply current of 0.01 mA results in energy efficiency and minimizes power consumption, ideal for power-sensitive applications.

Crystal Frequency (MHz): 3.58

Crystal frequency of 3.58 MHz ensures precise timing and synchronization in telephone line operations, improving overall performance.

Technical Specifications

Telephone Line ICs TCM5087DR attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SO16(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.5/10

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.01 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TCM5087DR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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