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TCM5091N

Texas Instruments

TCM5091N by Texas Instruments

Texas Instruments TCM5091N is a Telephone Line IC with 18 terminals in an IN-LINE package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Utilizes CMOS technology and features dual terminal position in a rectangular plastic/epoxy body.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,581 parts In-Stock

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4,581

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Digiode

USA . 3,268 parts In-Stock

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3,268

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Distributors (Availability)

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AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$7.534

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644

$7.534

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Parana Technologies

USA . 859 parts In-Stock

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$7.569

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-

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$8.080

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859

$7.569

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$8.080

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DigiPath Technology Company

USA . 1,359 parts In-Stock

1+ parts

$8.334

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$7.667

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1,359

$8.334

$7.667

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ChromeModa Solutions

Germany . 4,653 parts In-Stock

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$8.504

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$6.973

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4,653

$8.504

$6.973

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IDEA Electronic Components Group

UK . 2,183 parts In-Stock

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$8.504

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$8.079

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$7.654

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2,183

$8.504

$8.079

$7.654

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One Stop Electronics

USA . 982 parts In-Stock

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$385.000

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Corphita

USA . 2,213 parts In-Stock

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Overview

Enhance your telecommunications system with the TCM5091N by Texas Instruments, a top-quality Telephone Line IC designed to deliver superior performance and reliability. Manufactured by the industry leader, this product is perfect for a wide range of applications in the telecommunications industry. With its advanced technology and industrial-grade temperature rating, the TCM5091N ensures seamless communication and optimal functionality. Upgrade your systems today and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to damage, making this product suitable for various industrial applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy installation and integration into existing circuit designs, saving space and simplifying assembly.

No. of Terminals: 18

With 18 terminals, this product offers flexibility in connecting to other components or devices, allowing for versatile usage.

Package Style (Meter): IN-LINE

The in-line package style is commonly used and compatible with standard circuit layouts, making it easy to integrate into existing systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in challenging environments, making this product suitable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function well even in extreme cold conditions, increasing its versatility.

Terminal Position: DUAL

The dual terminal position provides redundancy and improves the reliability of connections, ensuring stable performance over time.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this product can withstand harsh environmental conditions typically found in industrial settings, making it a reliable choice for such applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of this product in various applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and ease of soldering, ensuring the longevity and stability of the overall system.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, this product is compatible with commonly used connectors and PCB layouts, simplifying integration and assembly processes.

Technical Specifications

Telephone Line ICs TCM5091N attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T18

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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