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TCM5087D

Texas Instruments

TCM5087D by Texas Instruments

TCM5087D by Texas Instruments is a Telephone Line IC with 16 terminals, operating at -30 to 70°C. It has a power supply of 3.5-10V and consumes 0.01mA current. This CMOS technology chip in small outline package is ideal for telephone line applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,318 parts In-Stock

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8,318

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Digiode

USA . 4,654 parts In-Stock

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4,654

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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AZTECH Wire

Italy . 433 parts In-Stock

1+ parts

$7.577

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433

$7.577

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Parana Technologies

USA . 651 parts In-Stock

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$10.961

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$11.425

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651

$10.961

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$11.425

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IDEA Electronic Components Group

UK . 1,353 parts In-Stock

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$12.316

100+ parts

$11.700

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$11.084

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1,353

$12.316

$11.700

$11.084

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ChromeModa Solutions

Germany . 405 parts In-Stock

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$12.316

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$10.099

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405

$12.316

$10.099

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One Stop Electronics

USA . 515 parts In-Stock

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$988.000

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515

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Corphita

USA . 1,684 parts In-Stock

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1,684

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DigiPath Technology Company

USA . 596 parts In-Stock

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$11.104

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596

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$11.104

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Overview

Upgrade your telephone line systems with the TCM5087D by Texas Instruments, a top-quality Telephone Line IC designed for optimal performance and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this product will meet your needs seamlessly. Perfect for a wide range of applications, this IC offers exceptional value and benefits to customers looking to enhance their communication systems. Say goodbye to limitations and hello to efficiency with the TCM5087D.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and resistance to external factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

Rectangular package shape is common and fits well into many different types of electronic devices.

Power Supplies (V): 3.5/10

With power supply options ranging from 3.5V to 10V, the product can be used in various applications with different voltage requirements.

No. of Terminals: 16

Having 16 terminals allows for versatile connections and functionality within a device or system.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is suitable for compact electronic devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows the product to function in cold environments without issues.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and connectivity options.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and mounting processes, making installation easier and more precise.

Maximum Supply Current: 0.01 mA

Low maximum supply current helps conserve power and minimize energy consumption in electronic systems.

Crystal Frequency (MHz): 3.58

With a crystal frequency of 3.58 MHz, the product is suitable for applications requiring precise timing and synchronization.

Technical Specifications

Telephone Line ICs TCM5087D attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SO16(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.5/10

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.01 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TCM5087D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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