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TCM5094N

Texas Instruments

TCM5094N by Texas Instruments

TCM5094N by Texas Instruments is a Telephone Line IC with 16 terminals, operating at -30 to 70°C. It has a voltage range of 3.5-10V and crystal frequency of 3.58MHz. Ideal for telecommunication applications due to its CMOS technology and through-hole terminal form.

Median Price

$1.100

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 67,442 parts In-Stock

1+ parts

-

100+ parts

$1.060

1k+ parts

$0.880

10k+ parts

$0.784

67,442

-

$1.060

$0.880

$0.784

DigiKey

USA . 67,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.330

10k+ parts

-

67,442

-

-

$1.330

-

Verical

USA . 67,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.100

10k+ parts

$0.981

67,442

-

-

$1.100

$0.981

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,932 parts In-Stock

1+ parts

$0.824

100+ parts

-

1k+ parts

-

10k+ parts

-

3,932

$0.824

-

-

-

Vyrian

USA . 2,142 parts In-Stock

1+ parts

$0.867

100+ parts

-

1k+ parts

-

10k+ parts

-

2,142

$0.867

-

-

-

Pride Electronics

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

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50

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-

-

-

Electronic Expediters

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,762 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,762

$0.780

-

-

-

Parana Technologies

USA . 1,342 parts In-Stock

1+ parts

$8.953

100+ parts

-

1k+ parts

$9.622

10k+ parts

-

1,342

$8.953

-

$9.622

-

DigiPath Technology Company

USA . 569 parts In-Stock

1+ parts

$9.858

100+ parts

-

1k+ parts

-

10k+ parts

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569

$9.858

-

-

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ChromeModa Solutions

Germany . 5,409 parts In-Stock

1+ parts

$10.059

100+ parts

$8.248

1k+ parts

-

10k+ parts

-

5,409

$10.059

$8.248

-

-

IDEA Electronic Components Group

UK . 942 parts In-Stock

1+ parts

$10.059

100+ parts

$9.556

1k+ parts

$9.053

10k+ parts

-

942

$10.059

$9.556

$9.053

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A-Z Elektronik GmbH

Germany . 122 parts In-Stock

1+ parts

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100+ parts

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122

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Overview

Experience superior quality and reliability with the TCM5094N by Texas Instruments, a leading manufacturer in the industry. As part of the Telephone Line ICs category, this product offers unmatched value and benefits for various applications. With its innovative technology and durable package design, customers can trust in the exceptional performance of this product. Upgrade your telecommunication systems with the TCM5094N and enjoy seamless connectivity and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the IC, ensuring a longer lifespan.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and mounting on circuit boards, saving space and allowing for a neat layout.

Power Supplies (V): 3.5/10

Ability to operate within a wide range of power supplies, from 3.5V to 10V, providing flexibility in various electronic applications.

No. of Terminals: 16

With 16 terminals, this IC can accommodate a variety of connections and functionalities, making it versatile for different telephone line applications.

Package Style (Meter): IN-LINE

In-line package style simplifies the integration of the IC into existing telephone line systems, ensuring compatibility and ease of installation.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C ensures reliable performance even in demanding environments or during prolonged usage.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature of -30°C allows the IC to function in cold conditions without compromising its performance.

Terminal Position: DUAL

Dual terminal positioning offers redundancy and improved connectivity, reducing the risk of signal loss or connection issues.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, ensuring efficient operation and minimal interference.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate easy and secure soldering to circuit boards, ensuring reliable connections and preventing dislodgement during operation.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm allows for easy integration with commonly used components and connectors, simplifying the design and assembly process.

Crystal Frequency (MHz): 3.58

With a crystal frequency of 3.58MHz, this IC can accurately process and transmit signals over telephone lines, ensuring clear and reliable communication.

Technical Specifications

Telephone Line ICs TCM5094N attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.5/10

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TCM5094N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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