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TCM5089D

Texas Instruments

TCM5089D by Texas Instruments

Texas Instruments TCM5089D is a Telephone Line IC in a small outline package with dual terminal position. Operating from -40 to 85°C, it uses CMOS technology and consumes only 0.002 mA at 3/10V. Ideal for industrial applications requiring crystal frequency of 3.58MHz.

Median Price

$3.350

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TEDSS.com

USA . 400 parts In-Stock

1+ parts

$3.350

100+ parts

$2.120

1k+ parts

-

10k+ parts

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400

$3.350

$2.120

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Vyrian

USA . 5,021 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,021

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Digiode

USA . 4,822 parts In-Stock

1+ parts

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-

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4,822

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 424 parts In-Stock

1+ parts

$5.600

100+ parts

-

1k+ parts

-

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424

$5.600

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Parana Technologies

USA . 938 parts In-Stock

1+ parts

$11.946

100+ parts

-

1k+ parts

$12.351

10k+ parts

-

938

$11.946

-

$12.351

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DigiPath Technology Company

USA . 1,864 parts In-Stock

1+ parts

$13.154

100+ parts

-

1k+ parts

-

10k+ parts

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1,864

$13.154

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IDEA Electronic Components Group

UK . 1,301 parts In-Stock

1+ parts

$13.422

100+ parts

$12.751

1k+ parts

$12.080

10k+ parts

-

1,301

$13.422

$12.751

$12.080

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ChromeModa Solutions

Germany . 206 parts In-Stock

1+ parts

$13.422

100+ parts

$11.006

1k+ parts

-

10k+ parts

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206

$13.422

$11.006

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One Stop Electronics

USA . 1,605 parts In-Stock

1+ parts

$44.000

100+ parts

-

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1,605

$44.000

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Corphita

USA . 2,825 parts In-Stock

1+ parts

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2,825

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Overview

Elevate your communication capabilities with the Texas Instruments TCM5089D Telephone Line IC. Designed with precision and expertise by a trusted manufacturer, this innovative product offers unparalleled quality and reliability. Ideal for a wide range of applications in the telecommunications industry, this compact device delivers superior performance and efficiency. Unlock the potential of seamless connectivity and enhanced functionality with the TCM5089D. Experience the value and benefits it brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and resistance to external factors, making it suitable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various electronic devices and systems.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, allowing for space-saving integration into electronic devices.

Power Supplies (V): 3/10

Support for a range of power supply voltages (3V to 10V) provides flexibility in compatibility with different systems and power sources.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for easy placement on circuit boards or PCBs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit board layout and enable versatile connection options.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this product is designed to withstand harsh industrial environments with consistent performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it a reliable choice for various applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering to circuit boards, ensuring secure connections for stable operation.

Maximum Supply Current: 0.002 mA

With a maximum supply current of only 0.002 mA, this product is energy-efficient and helps minimize power consumption in electronic systems.

Crystal Frequency (MHz): 3.58

The 3.58 MHz crystal frequency enables precise timing and synchronization in communication systems, ensuring reliable data transmission.

Technical Specifications

Telephone Line ICs TCM5089D attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

Crystal Frequency (MHz):

3.58

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SO(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/10

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.002 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TCM5089D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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