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MT88E45BN1

Zarlink Semiconductor

MT88E45BN1 by Zarlink Semiconductor

TELEPHONE CALLING NO IDENTIFICATION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;

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1k+

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AZTECH Wire

Italy . 263 parts In-Stock

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Technical Specifications

Telephone Line ICs MT88E45BN1 attributes and parameters. Explore more Telephone Line ICs devices from Zarlink Semiconductor

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

MT88E45BN1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Zarlink Semiconductor

Zarlink Semiconductor - Microsemi Company Overview Zarlink Semiconductor was acquired by Microsemi as of October 2011. Microsemi Corporation offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Zarlink Semiconductor - Microsemi Products The types of products manufactured by Zarlink Semiconductor - Microsemi include Analog Switches, Medical Surge Protection ICs, Laser Diode Drivers (LDD), Analog Amplifiers, Telephony ICs, Packet Processing ICs, Packet Switching ICs, Timing and Synchronization (DS1/E1, SONET/SDH) ICs, TDM/TSI Switches, ATM (Asynchronous Transfer Mode) ICs, Voice Processing ICs, Optoelectronic Products, Frequency Synthesis Products, Wireless Data Products, Ultra-low Power Communication Products, Baseband Signal Processing Products, and Cellular Telephony Products.

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