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TEA7031FP

STMicroelectronics

TEA7031FP by STMicroelectronics

TEA7031FP by STMicroelectronics is a Telephone Line IC with 28 terminals, operating at -5 to 45 °C. It features a supply voltage of 2.9V and max current of 30mA. Ideal for speaker phone circuits, this bipolar technology IC comes in a small outline package for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,680 parts In-Stock

1+ parts

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3,680

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Vyrian

USA . 2,242 parts In-Stock

1+ parts

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2,242

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Anansix

USA . 2,133 parts In-Stock

1+ parts

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2,133

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 289 parts In-Stock

1+ parts

$7.685

100+ parts

-

1k+ parts

$6.916

10k+ parts

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289

$7.685

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$6.916

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MKK Technologies

India . 1,352 parts In-Stock

1+ parts

$14.451

100+ parts

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1,352

$14.451

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DigiPath Technology Company

USA . 1,352 parts In-Stock

1+ parts

$14.451

100+ parts

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1,352

$14.451

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Corphita

USA . 2,913 parts In-Stock

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2,913

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Parana Technologies

USA . 565 parts In-Stock

1+ parts

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100+ parts

$9.188

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565

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$9.188

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Overview

Enhance your communication devices with the TEA7031FP by STMicroelectronics. This high-quality Telephone Line IC offers unmatched reliability and performance, thanks to the expertise of its manufacturer. Ideal for speaker phone circuits, this compact and efficient component ensures crystal-clear audio transmission while maximizing power efficiency. Upgrade your products with the TEA7031FP and experience the superior value and benefits it brings to your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the internal components.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving space and reducing overall product size.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and makes it easy to integrate into existing designs and layouts.

Power Supplies (V): 2.9

The 2.9V power supply ensures efficient power consumption while providing the necessary voltage for optimal performance.

No. of Terminals: 28

The high number of terminals allows for enhanced connectivity and functionality within the telephone line IC.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space on the PCB and makes it suitable for compact designs.

Maximum Operating Temperature: 45 °C

The high maximum operating temperature ensures reliable performance even under harsh environmental conditions.

Minimum Operating Temperature: -5 °C

The low minimum operating temperature allows for versatility in usage across different temperature ranges.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and reliability for the connections.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and ease of connection.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this product is suitable for standard commercial applications.

Technology: BIPOLAR

The bipolar technology used in this telephone line IC ensures stable and reliable operation.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of handling during assembly.

Maximum Supply Current: 30 mA

With a maximum supply current of 30 mA, this IC consumes low power while providing efficient performance.

Telecom IC Type: SPEAKER PHONE CIRCUIT

The speaker phone circuit type indicates that this IC is specifically designed for speakerphone functionalities in telecom applications.

Nominal Supply Voltage: 2.9 V

The nominal supply voltage of 2.9V ensures compatibility with standard power sources and optimizes performance.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for easy connection and compatibility with standard PCB layouts.

Technical Specifications

Telephone Line ICs TEA7031FP attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

No. of Terminals:

28

Maximum Operating Temperature:

45 Cel

Minimum Operating Temperature:

-5 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2.9

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

30 mA

Nominal Supply Voltage:

2.9 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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