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TEA7531FP

STMicroelectronics

TEA7531FP by STMicroelectronics

TEA7531FP by STMicroelectronics is a Telephone Line IC with 16 terminals, operating at -5 to 45 °C. It has a supply voltage of 3.15V and max current of 30mA. This bipolar technology speaker phone circuit is ideal for telecom applications requiring small outline surface mount packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,659 parts In-Stock

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2,659

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Digiode

USA . 2,196 parts In-Stock

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2,196

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Anansix

USA . 846 parts In-Stock

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846

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,260 parts In-Stock

1+ parts

$9.045

100+ parts

-

1k+ parts

$8.141

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2,260

$9.045

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$8.141

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MKK Technologies

India . 24 parts In-Stock

1+ parts

$17.009

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24

$17.009

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DigiPath Technology Company

USA . 24 parts In-Stock

1+ parts

$17.009

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24

$17.009

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Corphita

USA . 4,619 parts In-Stock

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4,619

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Parana Technologies

USA . 979 parts In-Stock

1+ parts

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$10.815

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979

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$10.815

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Overview

Enhance your communication devices with the TEA7531FP by STMicroelectronics. Crafted with precision and expertise, this Telephone Line IC offers unmatched quality and reliability. Ideal for speaker phone circuits, this product guarantees seamless performance and efficiency. With a small outline package style and commercial temperature grade, customers can trust in its durability and functionality. Upgrade your telecommunication systems today with the TEA7531FP and experience the difference it brings to your devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making this product a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, saving time and effort during production.

Package Shape: RECTANGULAR

Rectangular shape helps in easy handling and placement of the component on the PCB, optimizing space utilization.

Power Supplies (V): 3.15

Operating at a voltage of 3.15V ensures compatibility with standard power sources, making it versatile for various applications.

No. of Terminals: 16

With 16 terminals, this product offers ample connectivity options and functionality for advanced telecommunications circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, allowing for compact and efficient design layouts.

Maximum Operating Temperature: 45 °C

With a maximum operating temperature of 45 °C, this product can perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -5 °C

Operational at temperatures as low as -5 °C, this product is suitable for use in various climate conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish ensures good solderability and reliable electrical connections, enhancing the overall performance of the product.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and installation, accommodating different configurations.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that this product meets industry standards for performance and reliability in commercial applications.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and efficient power consumption, making this product suitable for telecom applications.

Terminal Form: GULL WING

Gull wing terminal form is ideal for surface mounting, providing secure and stable connections on the PCB.

Maximum Supply Current: 30 mA

With a maximum supply current of 30 mA, this product operates efficiently within the specified power limits, ensuring optimal performance.

Telecom IC Type: SPEAKER PHONE CIRCUIT

Designed specifically for speakerphone circuits, this product offers specialized features and functions for clear audio communication.

Nominal Supply Voltage: 3.15 V

Nominal supply voltage of 3.15V ensures consistent and reliable power delivery to the component, maintaining stable operation.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm enables precise placement and alignment on the PCB, ensuring reliable electrical connections and signal integrity.

Technical Specifications

Telephone Line ICs TEA7531FP attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

45 Cel

Minimum Operating Temperature:

-5 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.15

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

30 mA

Nominal Supply Voltage:

3.15 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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