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TEA7063DP

STMicroelectronics

TEA7063DP by STMicroelectronics

TEA7063DP by STMicroelectronics is a Telephone Line IC with -48V power supply, 20 terminals, and 3.3V nominal voltage. It is used in TELEPHONE SPEECH CIRCUIT applications due to its BIPOLAR technology and commercial temperature grade. The package style is small outline with gull wing terminal form for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,795 parts In-Stock

1+ parts

-

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2,795

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Digiode

USA . 1,607 parts In-Stock

1+ parts

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1,607

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Vyrian

USA . 1,338 parts In-Stock

1+ parts

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1,338

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ECAB

Sweden . 1,260 parts In-Stock

1+ parts

-

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1,260

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J2 Sourcing AB

Sweden . 150 parts In-Stock

1+ parts

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150

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Huijzer Components

Netherlands . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,584 parts In-Stock

1+ parts

$12.453

100+ parts

-

1k+ parts

$11.208

10k+ parts

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1,584

$12.453

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$11.208

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MKK Technologies

India . 2,195 parts In-Stock

1+ parts

$23.417

100+ parts

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2,195

$23.417

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DigiPath Technology Company

USA . 2,195 parts In-Stock

1+ parts

$23.417

100+ parts

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2,195

$23.417

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Corphita

USA . 3,989 parts In-Stock

1+ parts

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3,989

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Parana Technologies

USA . 1,833 parts In-Stock

1+ parts

-

100+ parts

$14.890

1k+ parts

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1,833

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$14.890

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Kepictronics

USA . 60 parts In-Stock

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60

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Overview

Enhance your communication devices with the TEA7063DP by STMicroelectronics, a top-tier manufacturer known for producing high-quality Telephone Line ICs. This versatile product offers unrivaled performance and reliability, making it ideal for a wide range of telecom applications. With its advanced technology and innovative design, the TEA7063DP provides customers with superior value, efficiency, and functionality. Upgrade your telecommunication systems today with this cutting-edge solution from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and efficient mounting on a PCB, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board.

Power Supplies (V) -48

Nominal negative supply voltage of -48V ensures compatibility with standard telecom systems.

No. of Terminals: 20

Provides ample connectivity options for the telephone line IC.

Maximum Operating Temperature 70 °C

Can withstand high temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature -20 °C

Can operate in low temperature conditions, increasing the product's versatility.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and layout.

Maximum Seated Height: 2.65 mm

Low seated height helps in space-constrained applications.

Width: 7.5 mm

Compact width allows for efficient use of PCB real estate.

Length: 12.8 mm

Optimal length for accommodating necessary circuit components.

Temperature Grade: COMMERCIAL

Suitable for commercial deployments in various industries.

Technology: BIPOLAR

Bipolar technology offers stable performance and low power consumption.

Nominal Negative Supply Voltage: -48 V

Compatible with standard telecom systems that operate on -48V.

Terminal Form: GULL WING

Gull wing terminals provide mechanical stability and ease of soldering.

Telecom IC Type: TELEPHONE SPEECH CIRCUIT

Specifically designed for telephone line applications, ensuring optimized performance.

Nominal Supply Voltage: 3.3 V

Works with a standard 3.3V supply voltage, suitable for various electronic systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch for ease of soldering and connectivity.

Technical Specifications

Telephone Line ICs TEA7063DP attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

Nominal Negative Supply Voltage:

-48 V

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

-48

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TEA7063DP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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