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TEA7092TQT

STMicroelectronics

TEA7092TQT by STMicroelectronics

TEA7092TQT by STMicroelectronics is a Telephone Line IC with 44 terminals, operating at -20 to 70 °C. It has power supplies of 2.5/7.5V and consumes 0.0036mA current. Ideal for telecom applications due to its TELEPHONE MULTIFUNCTION CIRCUIT type and low profile FLATPACK package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,500

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-

-

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Vyrian

USA . 1,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,635

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Anansix

USA . 914 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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914

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 830 parts In-Stock

1+ parts

$16.468

100+ parts

-

1k+ parts

$14.821

10k+ parts

-

830

$16.468

-

$14.821

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MKK Technologies

India . 1,375 parts In-Stock

1+ parts

$30.967

100+ parts

-

1k+ parts

-

10k+ parts

-

1,375

$30.967

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DigiPath Technology Company

USA . 1,375 parts In-Stock

1+ parts

$30.967

100+ parts

-

1k+ parts

-

10k+ parts

-

1,375

$30.967

-

-

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A-Z Elektronik GmbH

Germany . 6,219 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,219

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,500

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-

-

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Corphita

USA . 3,091 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,091

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-

-

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Parana Technologies

USA . 1,081 parts In-Stock

1+ parts

-

100+ parts

$19.690

1k+ parts

-

10k+ parts

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1,081

-

$19.690

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-

Overview

Elevate your telecommunications systems with the TEA7092TQT from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Telephone Line ICs that guarantee reliable performance and durability. Perfect for a wide range of applications, this product offers customers unparalleled value and benefits. Say goodbye to connectivity issues and hello to seamless communication with the TEA7092TQT - the ultimate solution for all your telecom needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Power Supplies (V): 2.5/7.5

Offers flexibility in power input options, accommodating a range of voltage requirements.

No. of Terminals: 44

Provides multiple connection points for integrating the IC with other components in a telephone system.

Package Style (Meter): FLATPACK, LOW PROFILE

Enables a compact and space-saving design, ideal for applications where size constraints are a consideration.

Maximum Operating Temperature: 70 °C

Ensures reliable performance within a wide range of temperature environments, suitable for various operating conditions.

Terminal Finish: TIN LEAD

Enhances solderability and conductivity, improving the overall reliability and performance of the IC.

Width: 10 mm

Compact dimensions facilitate integration into tight spacing layouts, maximizing efficiency in design.

Temperature Grade: COMMERCIAL

Designed to meet the temperature requirements of commercial applications, ensuring compatibility with standard operating conditions.

Technical Specifications

Telephone Line ICs TEA7092TQT attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e0

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

2.5/7.5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.0036 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TEA7092TQT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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