Loading...

MM53130N

Texas Instruments

MM53130N by Texas Instruments

Texas Instruments' MM53130N is a CMOS Telephone Line IC with 18 terminals in an IN-LINE package. Operating temp range: -40 to 70°C. Ideal for telecom applications requiring PLASTIC/EPOXY package material and Tin/Lead terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,223

-

-

-

-

Anansix

USA . 2,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,768

-

-

-

-

Digiode

USA . 2,163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,163

-

-

-

-

Semi Source

USA . 97 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

97

-

-

-

-

LittleDiode

UK . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,229 parts In-Stock

1+ parts

$7.083

100+ parts

$657.729

1k+ parts

$6.374

10k+ parts

-

2,229

$7.083

$657.729

$6.374

-

DigiPath Technology Company

USA . 748 parts In-Stock

1+ parts

$7.799

100+ parts

$7.175

1k+ parts

-

10k+ parts

-

748

$7.799

$7.175

-

-

ChromeModa Solutions

Germany . 3,879 parts In-Stock

1+ parts

$7.958

100+ parts

$6.526

1k+ parts

-

10k+ parts

-

3,879

$7.958

$6.526

-

-

IDEA Electronic Components Group

UK . 415 parts In-Stock

1+ parts

$7.958

100+ parts

-

1k+ parts

$7.162

10k+ parts

-

415

$7.958

-

$7.162

-

AZTECH Wire

Italy . 722 parts In-Stock

1+ parts

$17.417

100+ parts

-

1k+ parts

-

10k+ parts

-

722

$17.417

-

-

-

One Stop Electronics

USA . 208 parts In-Stock

1+ parts

$479.000

100+ parts

-

1k+ parts

-

10k+ parts

-

208

$479.000

-

-

-

Corphita

USA . 5,153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,153

-

-

-

-

Overview

Upgrade your telephone systems with the MM53130N by Texas Instruments, a high-quality Telephone Line IC designed to enhance communication and connectivity. Manufactured by the trusted brand Texas Instruments, this product offers reliability, efficiency, and performance. Ideal for a wide range of applications in telecommunications, the MM53130N ensures seamless operation and clear transmission. Experience the value and benefits of this top-notch product, providing customers with superior quality and advanced technology for all their communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the IC, ensuring a long lifespan for the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration of the IC into circuit designs and ensures compatibility with standard mounting techniques.

No. of Terminals: 18

Having 18 terminals allows for a wide range of connectivity options, making this IC versatile for different telephone line applications.

Package Style (Meter): IN-LINE

In-line package style is convenient for space-saving applications and ensures easy installation in telephone line systems.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C ensures stability and reliable performance in varying environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for reliable performance even in extreme cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish enhances solderability and conductivity, ensuring secure connections in the circuit.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit layout and allows for different connection configurations.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with modern telephone line systems.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy and secure through-board mounting, ensuring reliability in the circuit connection.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm ensures compatibility with common PCB designs and easy integration into existing circuits.

Technical Specifications

Telephone Line ICs MM53130N attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e0

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MM53130N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 12