Loading...

UCC2752DTRG4

Texas Instruments

UCC2752DTRG4 by Texas Instruments

UCC2752DTRG4 by Texas Instruments is a BICMOS technology Telephone Line IC with 16 terminals, operating at -40 to 85°C. It has a supply voltage of 12V and current of 3mA, suitable for industrial applications requiring surface mount packaging in plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,433

-

-

-

-

Digiode

USA . 1,208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,208

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 594 parts In-Stock

1+ parts

$11.935

100+ parts

-

1k+ parts

-

10k+ parts

-

594

$11.935

-

-

-

Parana Technologies

USA . 3 parts In-Stock

1+ parts

$13.079

100+ parts

$1,214.542

1k+ parts

$11.771

10k+ parts

-

3

$13.079

$1,214.542

$11.771

-

DigiPath Technology Company

USA . 1,453 parts In-Stock

1+ parts

$14.401

100+ parts

$13.249

1k+ parts

-

10k+ parts

-

1,453

$14.401

$13.249

-

-

ChromeModa Solutions

Germany . 4,225 parts In-Stock

1+ parts

$14.695

100+ parts

$12.050

1k+ parts

-

10k+ parts

-

4,225

$14.695

$12.050

-

-

IDEA Electronic Components Group

UK . 390 parts In-Stock

1+ parts

$14.695

100+ parts

$13.960

1k+ parts

$13.226

10k+ parts

-

390

$14.695

$13.960

$13.226

-

One Stop Electronics

USA . 133 parts In-Stock

1+ parts

$26.000

100+ parts

-

1k+ parts

-

10k+ parts

-

133

$26.000

-

-

-

Corphita

USA . 4,835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,835

-

-

-

-

Overview

Enhance the performance and reliability of your telephone line applications with the UCC2752DTRG4 by Texas Instruments. Trusted for its superior quality and innovative technology, this Telephone Line IC offers unmatched value and benefits to customers. With a wide operating temperature range and small outline package style, this product ensures seamless integration and efficient power management. Elevate your communication systems with the UCC2752DTRG4 and experience enhanced functionality and longevity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the internal components of the IC, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Power Supplies (V): 12

Operates on a standard power supply of 12V, making it compatible with most existing systems.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature range of -40 to 85°C, ensuring reliable performance in harsh environmental conditions.

Maximum Supply Current: 3 mA

Low supply current of 3mA minimizes power consumption, making it energy-efficient and cost-effective in long-term usage.

Technical Specifications

Telephone Line ICs UCC2752DTRG4 attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

3 mA

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 2