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TEA1067

NXP Semiconductors

TEA1067 by NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (In-Stock)

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TEDSS.com

USA . 1,000 parts In-Stock

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$1.000

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$0.860

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Digiode

USA . 3,489 parts In-Stock

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Vyrian

USA . 2,534 parts In-Stock

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Electronics Depot

USA . 1,838 parts In-Stock

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Sunrise Surplus Inc.

USA . 1,226 parts In-Stock

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Anansix

USA . 1,218 parts In-Stock

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Huijzer Components

Netherlands . 1,003 parts In-Stock

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Infinite Electronics LLP

India . 1,000 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 812 parts In-Stock

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Lakeland Logistics Inc

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699

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Bristol Electronics

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ECAB

Sweden . 438 parts In-Stock

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ComSIT Distribution GmbH

Germany . 204 parts In-Stock

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Sogenti Electronics

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Mentor Electronics Marketing, LLC

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Goldney Electronics S.L.

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Ack Elektronik San.Tic.Ltd.Sti

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Odintec Ltd.

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Manotoh

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J2 Sourcing AB

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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LittleDiode

UK . 17 parts In-Stock

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Electronic Expediters

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GES GmbH

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Distributors (Availability)

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One Stop Electronics

USA . 760 parts In-Stock

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Authorized Procurement Solutions

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Infinite Electronics LLP (Excess)

. 3,459 parts In-Stock

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Corphita

USA . 2,660 parts In-Stock

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UNI Independent Distributors

Spain . 2,476 parts In-Stock

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Schahn Electronic Components

Germany . 2,100 parts In-Stock

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Kepictronics

USA . 1,200 parts In-Stock

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Assy Fe

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Technical Specifications

Telephone Line ICs TEA1067 attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDIP-T18

Length:

21.6 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Nominal Supply Voltage:

2.8 V

Surface Mount:

NO

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TEA1067 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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