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PCD3310CT

NXP Semiconductors

PCD3310CT by NXP Semiconductors

PCD3310CT by NXP Semiconductors is a compact telephone dialer circuit IC designed for surface mount applications. It operates at a nominal voltage of 3V, with a max supply current of 0.2mA and supports temperatures from -25 °C to 70 °C. Ideal for telecom devices, it features a dual terminal position in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,774 parts In-Stock

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Vyrian

USA . 563 parts In-Stock

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Anansix

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420

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One Stop Electronics

USA . 979 parts In-Stock

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$155.000

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979

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UNI Independent Distributors

Spain . 7,960 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 4,266 parts In-Stock

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Corphita

USA . 1,514 parts In-Stock

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Overview

Elevate your telecom solutions with the PCD3310CT from NXP Semiconductors, a leader in innovative technology. This highly reliable Telephone Line IC delivers superior performance for a range of applications, ensuring seamless communication experiences. Its compact design and energy efficiency translate to cost savings, while NXP’s commitment to quality guarantees longevity and reliability. Empower your projects with this trusted component and experience unparalleled connectivity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors, making this Telephone Line IC suitable for various applications.

Surface Mount: YES

Being surface mount technology (SMT) compatible allows for easier integration onto circuit boards, saving space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, making it ideal for compact designs.

No. of Terminals: 28

With 28 terminals, it offers multiple connection possibilities, enabling more complex functions and features on a single chip.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides a compact form factor, facilitating use in size-constrained environments and portable devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, it can operate effectively in moderately high thermal environments, maintaining performance and reliability.

Minimum Operating Temperature: -25 °C

The safe operation at -25 °C ensures that this IC can function in various climates, making it versatile for different applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and layout, making it easier for designers to incorporate the IC into their projects.

Maximum Seated Height: 2.65 mm

A maximum seated height of 2.65 mm contributes to its low profile design, ideal for space-constrained applications.

Width: 7.5 mm

At 7.5 mm wide, it maintains a compact footprint, facilitating easier integration into various devices.

Length: 17.9 mm

The length of 17.9 mm is practical for fitting within standard PCB layouts, enhancing compatibility with existing designs.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering reliability, ensuring strong electrical connections during installation.

Maximum Supply Current: 0.2 mA

A low maximum supply current of 0.2 mA contributes to reduced power consumption, making this IC energy-efficient for battery-powered devices.

Telecom IC Type: TELEPHONE DIALER CIRCUIT

As a specialized telephone dialer circuit, it is optimized for telecommunication applications, ensuring high performance in dialing functionalities.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V makes it compatible with common low-voltage systems, enhancing its versatility.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for compatibility with a wide range of PCB layouts and assembly techniques, improving design flexibility.

Make-break Ratio: 1:2

The 1:2 make-break ratio is suitable for standard telephone operations, ensuring reliable dialing functionality.

Technical Specifications

Telephone Line ICs PCD3310CT attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

Make-break Ratio:

1:2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

PCD3310CT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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