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PCD3312CT

NXP Semiconductors

PCD3312CT by NXP Semiconductors

NXP Semiconductors' PCD3312CT is a Telephone Line IC with 8 terminals, operating at 3/5V. It features CMOS technology, GULL WING terminal form, and crystal frequency of 3.58MHz. Ideal for telecom applications due to its small outline package and low supply current of 0.0009mA.

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Flip Electronics

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Overview

Discover the PCD3312CT by NXP Semiconductors, a cutting-edge Telephone Line IC designed to revolutionize communication technology. With a focus on quality and innovation, NXP Semiconductors delivers unparalleled performance and reliability in every product. The PCD3312CT is a versatile solution for a wide range of applications, offering customers unmatched value and benefits. Experience seamless connectivity and enhanced functionality with this advanced telecom IC, setting new standards in the industry. Choose NXP Semiconductors for superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and reliability are important factors.

Surface Mount: YES

Being surface mountable makes installation easier and allows for a more compact design, saving space on the PCB.

Power Supplies (V): 3/5

The dual power supply options of 3V and 5V provide flexibility in compatibility with different systems and voltage requirements.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and functionality in telephone line applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for high-density mounting and space-saving on the PCB. Perfect for compact designs.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75°C, this product can withstand high heat environments without compromising performance.

Technology: CMOS

CMOS technology ensures low power consumption and efficient operation, making this product energy-efficient and cost-effective.

Crystal Frequency (MHz): 3.58

The crystal frequency of 3.58MHz provides stable and precise timing for telephone line applications, ensuring reliable operation.

Technical Specifications

Telephone Line ICs PCD3312CT attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDSO-G8

Length:

7.55 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.0009 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

PCD3312CT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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