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PCD3310ET

NXP Semiconductors

PCD3310ET by NXP Semiconductors

PCD3310ET by NXP Semiconductors is a compact telephone dialer circuit IC designed for surface mount applications. It operates at a nominal voltage of 3V, with a max current of 0.2mA and supports temperatures from -25 °C to 70 °C. Ideal for telecom devices, it features a dual terminal position in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,105 parts In-Stock

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4,105

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Anansix

USA . 1,979 parts In-Stock

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1,979

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Vyrian

USA . 278 parts In-Stock

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278

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One Stop Electronics

USA . 550 parts In-Stock

1+ parts

$587.000

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550

$587.000

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UNI Independent Distributors

Spain . 4,589 parts In-Stock

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4,589

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Corphita

USA . 2,159 parts In-Stock

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Overview

Elevate your telecommunications solutions with the PCD3310ET from NXP Semiconductors, a trusted leader in innovation. This premier Telephone Line IC delivers exceptional quality and reliability, ensuring seamless connectivity for various applications. With its compact design and efficient power usage, it enhances performance while reducing energy costs. Choose PCD3310ET for unmatched value and reliability, empowering your projects with cutting-edge technology that stands the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers durability and protection against environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mount enables easy integration into compact electronic designs, saving space on PCB layouts.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for space utilization, making it suitable for a variety of circuit board layouts.

No. of Terminals: 28

With 28 terminals, this IC provides ample connectivity options for integrated circuit designs, accommodating complex functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures that the IC can fit into smaller, densely packed environments, perfect for portable devices.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures the IC can operate reliably in a variety of environments, suitable for both consumer and industrial applications.

Minimum Operating Temperature: -25 °C

With a low minimum operating temperature of -25 °C, this IC is capable of functioning in cold environments, expanding its range of application.

Terminal Position: DUAL

Dual terminal position provides versatility in circuit design and layout options, facilitating easy routing of signals.

Maximum Seated Height: 2.65 mm

The low maximum seated height allows for compact designs in devices, making it an excellent choice for slim electronics.

Width: 7.5 mm

With a width of 7.5 mm, this IC's dimensions contribute to its compact form factor, suitable for space-constrained applications.

Length: 17.9 mm

The length of 17.9 mm provides a balanced footprint, ensuring efficient placement on PCBs without compromising functionality.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering ease and ensures secure connections, leading to improved reliability in performance.

Maximum Supply Current: 0.2 mA

A low maximum supply current of 0.2 mA makes this IC energy-efficient, ideal for battery-operated devices and minimizing power consumption.

Telecom IC Type: TELEPHONE DIALER CIRCUIT

As a telephone dialer circuit, this IC is specifically designed for telecommunications applications, ensuring optimal performance in dialing operations.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V makes this IC compatible with low-voltage systems, enhancing its usability across modern electronic devices.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for finer component placement on PCBs, making it easier to achieve denser layouts.

Make-break Ratio: 1:2

A make-break ratio of 1:2 supports effective signal management and dialing functions, ensuring reliable operation in communication systems.

Technical Specifications

Telephone Line ICs PCD3310ET attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

Make-break Ratio:

1:2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

PCD3310ET Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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