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PCD3310CP

NXP Semiconductors

PCD3310CP by NXP Semiconductors

PCD3310CP by NXP Semiconductors is a telephone dialer circuit IC designed for efficient telecom applications. It operates at a nominal voltage of 3V, with a max supply current of 0.2mA and supports temperatures from -25 °C to 70 °C. Its compact design features 20 terminals in an in-line package, ideal for space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Digiode

USA . 3,829 parts In-Stock

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Anansix

USA . 1,701 parts In-Stock

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Vyrian

USA . 838 parts In-Stock

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Odintec Ltd.

Israel . 500 parts In-Stock

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500

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Manotoh

Italy . 11 parts In-Stock

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LWI Electronics Inc

India . 8 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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One Stop Electronics

USA . 470 parts In-Stock

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$461.000

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UNI Independent Distributors

Spain . 6,503 parts In-Stock

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Corphita

USA . 2,752 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 2,352 parts In-Stock

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Overview

Elevate your telecommunications projects with the PCD3310CP from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a reliable telephone line IC that enhances dialer efficiency while ensuring robust performance across diverse applications. With its durable design and impressive temperature range, the PCD3310CP ensures dependable connectivity, providing you with lasting value and peace of mind in every call.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, ensuring long-term reliability of the telephone line IC.

Package Shape: RECTANGULAR

A rectangular shape allows for efficient space utilization on printed circuit boards, which is important for compact designs.

No. of Terminals: 20

With 20 terminals, this IC can support multiple connections, making it versatile for various applications.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy integration into existing circuits and allows for straightforward soldering processes.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C makes this IC suitable for a wide range of environments, ensuring reliable operation in high-temperature settings.

Minimum Operating Temperature: -25 °C

The ability to operate at temperatures as low as -25 °C expands its usability in colder climates, enhancing design flexibility.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity and simplifies the design of the PCB layout, improving performance.

Maximum Seated Height: 4.2 mm

A low maximum seated height helps in maintaining a compact form factor, ideal for space-constrained designs.

Width: 7.62 mm

A width of 7.62 mm allows for more compact circuit designs, making it suitable for small housing electronics.

Length: 26.73 mm

The length of 26.73 mm provides ample room for connections while maintaining a compact profile, offering design flexibility.

Terminal Form: THROUGH-HOLE

Through-hole terminal form is reliable and easy to work with, ensuring a solid connection that can endure mechanical stresses.

Maximum Supply Current: 0.2 mA

Low maximum supply current ensures power efficiency, making this IC ideal for battery-operated devices.

Telecom IC Type: TELEPHONE DIALER CIRCUIT

Designed specifically for telephone dialing applications, this IC meets the needs of a variety of telecom projects.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is standard for many devices, ensuring compatibility and versatility in electronic designs.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is a common standard, simplifying the integration with various PCB designs and components.

Make-break Ratio: 1:2

A make-break ratio of 1:2 ensures efficient performance in dialing applications, optimizing the user experience.

Technical Specifications

Telephone Line ICs PCD3310CP attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDIP-T20

Length:

26.73 mm

Make-break Ratio:

1:2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

PCD3310CP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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