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PCD3310FP

NXP Semiconductors

PCD3310FP by NXP Semiconductors

PCD3310FP by NXP Semiconductors is a telephone dialer circuit IC designed for efficient telecom applications. It operates b/w -25 °C to 70 °C, with a max supply current of 0.2 mA and nominal voltage of 3 V. Its compact design features 20 terminals in an in-line package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,725 parts In-Stock

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Anansix

USA . 2,551 parts In-Stock

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2,551

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Digiode

USA . 2,199 parts In-Stock

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2,199

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 877 parts In-Stock

1+ parts

$86.000

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877

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UNI Independent Distributors

Spain . 7,457 parts In-Stock

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7,457

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Corphita

USA . 733 parts In-Stock

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733

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Overview

Elevate your telecommunications with the PCD3310FP from NXP Semiconductors, renowned for its superior quality and reliability. This telephone line IC is designed to enhance communication systems, providing seamless dialing functionality for various applications. With NXP's commitment to innovation, you gain not just a product, but a partner in elevating your connectivity solutions. Experience efficiency, durability, and exceptional performance that empowers your devices to thrive in any environment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making this Telephone Line IC reliable for long-term applications.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient use of space within electronic devices, making it suitable for compact designs.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and functionalities, enhancing the versatility of the Telephone Line IC.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy integration into existing PCB designs, streamlining the manufacturing process.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is well-suited for various environments, ensuring reliability under typical operational conditions.

Minimum Operating Temperature: -25 °C

The wide operating temperature range, down to -25 °C, ensures that this Telephone Line IC can function effectively in colder climates and challenging conditions.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout design, allowing for enhanced connectivity options on the PCB.

Maximum Seated Height: 4.2 mm

A maximum seated height of 4.2 mm ensures low-profile installation, making it compatible with slimline devices.

Width: 7.62 mm

The compact width of 7.62 mm allows for space-efficient designs, ideal for modern electronics requiring minimal footprint.

Length: 26.73 mm

The length of 26.73 mm provides adequate space for terminal layout, supporting better electrical connections in printed circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical stability and soldering reliability, which is essential for durable connections.

Maximum Supply Current: 0.2 mA

The low maximum supply current of 0.2 mA improves energy efficiency, making it an eco-friendly choice for battery-operated applications.

Telecom IC Type: TELEPHONE DIALER CIRCUIT

Being specifically designed as a telephone dialer circuit makes this IC a perfect choice for telecommunication devices, ensuring compatibility and optimized performance.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V supports low-power applications, facilitating energy savings without compromising performance.

Terminal Pitch: 2.54 mm

Standard 2.54 mm terminal pitch allows compatibility with a wide range of components and PCB designs, enhancing integration capabilities.

Make-break Ratio: 1:2

The make-break ratio of 1:2 optimizes dialing functionality, ensuring quick and efficient transitions during operation.

Technical Specifications

Telephone Line ICs PCD3310FP attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDIP-T20

Length:

26.73 mm

Make-break Ratio:

1:2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

PCD3310FP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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