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UCC2752DG4

Texas Instruments

UCC2752DG4 by Texas Instruments

UCC2752DG4 by Texas Instruments is a Telephone Line IC with 16 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. With a supply voltage of 12V and max current of 3mA, it is ideal for telecommunications applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,397 parts In-Stock

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4,397

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Digiode

USA . 3,939 parts In-Stock

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3,939

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 915 parts In-Stock

1+ parts

$12.518

100+ parts

-

1k+ parts

$12.966

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915

$12.518

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$12.966

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DigiPath Technology Company

USA . 1,893 parts In-Stock

1+ parts

$13.784

100+ parts

$12.681

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1,893

$13.784

$12.681

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AZTECH Wire

Italy . 288 parts In-Stock

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$14.051

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288

$14.051

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ChromeModa Solutions

Germany . 5,845 parts In-Stock

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$14.065

100+ parts

$11.533

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5,845

$14.065

$11.533

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IDEA Electronic Components Group

UK . 1,193 parts In-Stock

1+ parts

$14.065

100+ parts

$13.362

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$12.658

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1,193

$14.065

$13.362

$12.658

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One Stop Electronics

USA . 1,573 parts In-Stock

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$385.000

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1,573

$385.000

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Corphita

USA . 3,318 parts In-Stock

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Overview

Upgrade your communication systems with the UCC2752DG4 from Texas Instruments, a leading manufacturer known for its top-notch quality and reliability. As part of the Telephone Line ICs category, this product offers seamless integration and enhanced performance for various applications. With a package designed for easy installation and operation, customers can enjoy the benefits of improved efficiency and functionality. Trust in Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides a durable and lightweight housing for the IC, ensuring longevity and easy handling during assembly.

Surface Mount: YES

Surface mount capability allows for easy and secure attachment to circuit boards, saving space and improving overall circuit layout.

Power Supplies (V): 12

Operating at a 12V supply voltage provides a stable power source for the IC, ensuring consistent performance and reliability.

No. of Terminals: 16

Having 16 terminals allows for connectivity to multiple components or peripherals, increasing the versatility and functionality of the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand harsh environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the IC can function in a wide range of temperature environments, making it suitable for various applications.

Technology: BICMOS

Utilizing BICMOS technology allows for a combination of bipolar and CMOS characteristics, resulting in high performance and low power consumption.

Maximum Supply Current: 3 mA

A maximum supply current of 3 mA indicates low power consumption, leading to energy-efficient operation and minimizing the overall power requirements of the system.

Technical Specifications

Telephone Line ICs UCC2752DG4 attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

3 mA

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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