Loading...

LB1009AE

STMicroelectronics

LB1009AE by STMicroelectronics

STMicroelectronics LB1009AE is a Telephone Line IC with 20 terminals in an IN-LINE package. It operates b/w 0-60 °C, suitable for TIP-RING VOLTAGE applications. This BIPOLAR technology IC has DUAL terminal position and PLASTIC/EPOXY body material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,567

-

-

-

-

Vyrian

USA . 1,488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,488

-

-

-

-

Anansix

USA . 1,137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,137

-

-

-

-

Inland Empire Components Inc.

USA . 358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

358

-

-

-

-

MISTER SPROCKETS

USA . 13 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 723 parts In-Stock

1+ parts

$6.009

100+ parts

-

1k+ parts

$5.408

10k+ parts

-

723

$6.009

-

$5.408

-

MKK Technologies

India . 88 parts In-Stock

1+ parts

$11.300

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$11.300

-

-

-

DigiPath Technology Company

USA . 88 parts In-Stock

1+ parts

$11.300

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$11.300

-

-

-

Corphita

USA . 4,559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,559

-

-

-

-

Parana Technologies

USA . 2,181 parts In-Stock

1+ parts

-

100+ parts

$7.185

1k+ parts

-

10k+ parts

-

2,181

-

$7.185

-

-

Overview

Elevate your communication systems with the LB1009AE from STMicroelectronics, a leading manufacturer in the industry. Designed for Telephone Line ICs, this high-quality product is perfect for a wide range of applications. With a durable plastic/epoxy package body and 20 terminals in an in-line style, the LB1009AE offers unmatched reliability and performance. Trust in STMicroelectronics to deliver innovative solutions that exceed expectations. Upgrade your technology today with the LB1009AE and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for electronic components that may be subject to wear and tear.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration with other components in a circuit design, making it convenient for installation and maintenance.

Power Supplies (V): TIP-RING VOLTAGE

Being able to handle TIP-RING voltage as power supplies provides flexibility in different telephone line systems, ensuring compatibility with various setups.

No. of Terminals: 20

Having 20 terminals allows for connectivity to multiple components and circuits, making this product versatile and suitable for complex telephone line applications.

Package Style (Meter): IN-LINE

The in-line package style saves space in a circuit layout, making it efficient for compact designs and enables neat and organized assembly.

Maximum Operating Temperature: 60 °C

With a high maximum operating temperature of 60 °C, this product can withstand thermal stress in demanding environments, enhancing its reliability and longevity.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures that this product can function in various temperature conditions, providing consistent performance throughout the year.

Terminal Position: DUAL

The dual terminal position allows for quick and secure connections, reducing the risk of signal loss or interference, enhancing the overall performance of the product.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product meets industry standards for performance and reliability, ensuring consistent operation in business environments.

Technology: BIPOLAR

Utilizing bipolar technology offers fast and efficient signal processing, making this product suitable for high-speed data transmission in telephone line communication.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure mechanical connection, ideal for applications requiring stability and robustness in harsh operating conditions.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy soldering and assembly, facilitating efficient installation and maintenance of the product in a circuit board.

Technical Specifications

Telephone Line ICs LB1009AE attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

TIP-RING VOLTAGE

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17