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TCM1506BP

Texas Instruments

TCM1506BP by Texas Instruments

Texas Instruments TCM1506BP is a Telephone Line IC with BICMOS tech. It has 8 terminals, operates b/w -20 to 70°C, and draws 0.0013 mA max current. Ideal for telephone ringer circuits due to its compact IN-LINE package style and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,878 parts In-Stock

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4,878

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Digiode

USA . 3,421 parts In-Stock

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3,421

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Semtec, LLC

USA . 130 parts In-Stock

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130

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R&J Components

USA . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 442 parts In-Stock

1+ parts

$11.705

100+ parts

-

1k+ parts

$12.093

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442

$11.705

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$12.093

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ChromeModa Solutions

Germany . 6,916 parts In-Stock

1+ parts

$13.152

100+ parts

$10.785

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6,916

$13.152

$10.785

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IDEA Electronic Components Group

UK . 1,736 parts In-Stock

1+ parts

$13.152

100+ parts

$12.494

1k+ parts

$11.837

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1,736

$13.152

$12.494

$11.837

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AZTECH Wire

Italy . 821 parts In-Stock

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$13.985

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821

$13.985

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One Stop Electronics

USA . 606 parts In-Stock

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$21.000

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606

$21.000

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A-Z Elektronik GmbH

Germany . 5,550 parts In-Stock

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5,550

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Corphita

USA . 2,432 parts In-Stock

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2,432

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DigiPath Technology Company

USA . 921 parts In-Stock

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$11.858

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921

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$11.858

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Metaverse IC Inc.

Canada . 592 parts In-Stock

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592

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Kepictronics

USA . 36 parts In-Stock

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Overview

Enhance your telecommunications projects with the TCM1506BP by Texas Instruments. Crafted with precision and expertise, this Telephone Line IC delivers top-notch quality and reliability. Perfect for telephone ringer circuits, this versatile component offers unmatched value and benefits to customers seeking seamless communication solutions. Trust in Texas Instruments for cutting-edge technology that exceeds expectations. Elevate your designs with the TCM1506BP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring a longer lifespan.

No. of Terminals: 8

Having 8 terminals allows for flexibility in connecting the IC to other components, enhancing its functionality.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand various environmental conditions and maintain its performance.

Technology: BICMOS

Being based on BICMOS technology, this IC offers a good balance between speed and power consumption, making it efficient for telecom applications.

Technical Specifications

Telephone Line ICs TCM1506BP attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

Length:

9.81 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.0013 mA

Surface Mount:

NO

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM1506BP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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