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LS1241

STMicroelectronics

LS1241 by STMicroelectronics

STMicroelectronics LS1241 is a Telephone Line IC with 8 terminals, operating at -20 to 70 °C. It has a supply voltage of 26V and uses bipolar technology. The package style is in-line, made of plastic/epoxy, suitable for commercial temperature grade applications.

Median Price

$0.620

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 7,900 parts In-Stock

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7,900

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Vyrian

USA . 3,071 parts In-Stock

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3,071

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Component Sense

UK . 1,781 parts In-Stock

1+ parts

-

100+ parts

$0.620

1k+ parts

$0.420

10k+ parts

$0.420

1,781

-

$0.620

$0.420

$0.420

Anansix

USA . 325 parts In-Stock

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325

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Digiode

USA . 159 parts In-Stock

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159

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ECAB

Sweden . 14 parts In-Stock

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14

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Corel Iberica Componentes, S.L.

Spain . 12 parts In-Stock

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 470 parts In-Stock

1+ parts

$10.653

100+ parts

-

1k+ parts

$9.587

10k+ parts

-

470

$10.653

-

$9.587

-

MKK Technologies

India . 843 parts In-Stock

1+ parts

$20.032

100+ parts

-

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843

$20.032

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DigiPath Technology Company

USA . 843 parts In-Stock

1+ parts

$20.032

100+ parts

-

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843

$20.032

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A-Z Elektronik GmbH

Germany . 7,323 parts In-Stock

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7,323

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Alle Elektronik GmbH

Germany . 4,882 parts In-Stock

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4,882

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Corphita

USA . 2,149 parts In-Stock

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2,149

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Assy Fe

Spain . 1,027 parts In-Stock

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1,027

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Metaverse IC Inc.

Canada . 394 parts In-Stock

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394

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Parana Technologies

USA . 135 parts In-Stock

1+ parts

-

100+ parts

$12.737

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135

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$12.737

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Overview

Elevate your communication systems with the LS1241 from STMicroelectronics, a leading manufacturer known for superior quality and reliability. Designed for Telephone Line ICs, this product offers precise performance and seamless integration for various applications. With its innovative technology and commercial-grade temperature grade, the LS1241 delivers exceptional value and benefits to customers seeking top-notch solutions. Upgrade your systems today with the LS1241 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to damage, ensuring longevity and reliability of the product.

Power Supplies (V): 26

With a power supply of 26V, this telephone line IC can handle a wide range of voltages, making it versatile and suitable for various applications.

No. of Terminals: 8

Having 8 terminals allows for more connectivity options and flexibility in installation, making this IC a practical choice for different setups.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures that this IC can function efficiently even in demanding environments, enhancing its reliability.

Technology: BIPOLAR

The bipolar technology utilized in this IC offers stable and precise performance, making it a reliable choice for telephone line applications.

Technical Specifications

Telephone Line ICs LS1241 attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

26

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Nominal Supply Voltage:

26 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

LS1241 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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