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L3913

STMicroelectronics

L3913 by STMicroelectronics

STMicroelectronics L3913 is a Telephone Line IC in a 44-terminal square chip carrier package. It operates at 3.4V with J bend terminals on 1.27mm pitch, suitable for telephone multifunction circuits due to its 1:1.5 make-break ratio.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,788

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-

-

-

Vyrian

USA . 2,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,038

-

-

-

-

Digiode

USA . 1,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,411

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,077 parts In-Stock

1+ parts

$15.634

100+ parts

-

1k+ parts

$14.070

10k+ parts

-

2,077

$15.634

-

$14.070

-

MKK Technologies

India . 1,097 parts In-Stock

1+ parts

$29.398

100+ parts

-

1k+ parts

-

10k+ parts

-

1,097

$29.398

-

-

-

DigiPath Technology Company

USA . 1,097 parts In-Stock

1+ parts

$29.398

100+ parts

-

1k+ parts

-

10k+ parts

-

1,097

$29.398

-

-

-

Corphita

USA . 3,757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,757

-

-

-

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Parana Technologies

USA . 839 parts In-Stock

1+ parts

-

100+ parts

$18.692

1k+ parts

-

10k+ parts

-

839

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$18.692

-

-

Overview

Upgrade your telephone systems with the cutting-edge L3913 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics ensures top-notch quality and reliability in their Telephone Line ICs. With a focus on innovation and customer satisfaction, this product offers unmatched value and benefits for your communication needs. From improved call quality to enhanced connectivity, the L3913 is designed to elevate your telecommunication experience. Trust STMicroelectronics to deliver excellence in every aspect of your telephone line IC requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or handheld devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during production.

Package Shape: SQUARE

Square package shape provides efficient use of board space and allows for easier placement on the PCB.

No. of Terminals: 44

Having a higher number of terminals enables the IC to handle multiple connections or functions, increasing versatility.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal conductivity and electrical performance, ensuring reliable operation.

Terminal Position: QUAD

Quad terminal position allows for easy and secure soldering onto the PCB, improving connection reliability.

Maximum Seated Height: 4.57 mm

Low seated height reduces overall profile, making the IC suitable for slim devices or applications with space constraints.

Width: 16.5862 mm

Appropriate width ensures compatibility with standard PCB layouts, facilitating integration into various electronic designs.

Length: 16.5862 mm

Optimal length provides a balance between compact size and adequate spacing for components, enhancing overall PCB layout flexibility.

Terminal Form: J BEND

J bend terminal form offers mechanical strength and stability during soldering, reducing the risk of connection issues or failures.

Telecom IC Type: TELEPHONE MULTIFUNCTION CIRCUIT

The multifunction circuit design enables the IC to perform various telephone-related tasks efficiently, making it a versatile choice for telecommunication applications.

Nominal Supply Voltage: 3.4 V

Operating at a low supply voltage helps in reducing power consumption and heat dissipation, contributing to energy efficiency and prolonged device lifespan.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting, enabling the IC to pack more functionality in a limited space on the PCB.

Make-break Ratio: 1:1.5

The optimized make-break ratio ensures reliable switching performance, reducing signal loss or interference in telephone line applications.

Technical Specifications

Telephone Line ICs L3913 attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

Additional Features:

SELECTABLE MAKE/BREAK RATIO 1:2

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

Make-break Ratio:

1:1.5

No. of Functions:

1

No. of Terminals:

44

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

3.4 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

L3913 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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