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ML8205AE

STMicroelectronics

ML8205AE by STMicroelectronics

STMicroelectronics ML8205AE is a Telephone Line IC with 8 terminals, operating at -45 to 65 °C. It has a supply voltage of 29V and uses bipolar technology. The package style is in-line, making it suitable for telephone line applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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ABC Electronics Ltd.

UK . 2,036 parts In-Stock

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2,036

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Electronic Expediters

USA . 1,488 parts In-Stock

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Anansix

USA . 1,446 parts In-Stock

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1,446

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Digiode

USA . 1,251 parts In-Stock

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Vyrian

USA . 476 parts In-Stock

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476

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Corel Iberica Componentes, S.L.

Spain . 17 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 537 parts In-Stock

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$13.277

100+ parts

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$11.949

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537

$13.277

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$11.949

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MKK Technologies

India . 749 parts In-Stock

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$24.966

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749

$24.966

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DigiPath Technology Company

USA . 749 parts In-Stock

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$24.966

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749

$24.966

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Parana Technologies

USA . 2,177 parts In-Stock

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$15.874

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2,177

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$15.874

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Corphita

USA . 390 parts In-Stock

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390

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Assy Fe

Spain . 17 parts In-Stock

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Overview

Upgrade your telephone systems with the ML8205AE from STMicroelectronics. Designed with top-notch quality and reliability, this Telephone Line IC is perfect for a wide range of applications. Whether you need to enhance your home phone or office communication systems, this product offers unmatched value, benefits, and advantages. Trust in STMicroelectronics for cutting-edge technology that delivers exceptional performance and functionality. Elevate your communication experience with the ML8205AE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring longevity and ease of handling.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices or systems.

Power Supplies (V): 29

Operating at 29V ensures compatibility with a wide range of power sources and provides sufficient power for reliable performance.

No. of Terminals: 8

Having 8 terminals allows for more connections and flexibility in circuit design.

Package Style (Meter): IN-LINE

In-line package style simplifies PCB layout and assembly, making installation easier for manufacturers.

Maximum Operating Temperature: 65 °C

With a maximum operating temperature of 65 °C, this product can reliably function in various environments without overheating.

Minimum Operating Temperature: -45 °C

The wide temperature range of -45 °C to 65°C ensures the product can handle extreme temperature conditions without performance degradation.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures a secure connection for stable operation.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and low distortion, making it ideal for telecommunication applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals make soldering easier and provide a more mechanically stable connection compared to surface-mount technology.

Nominal Supply Voltage: 29 V

The nominal supply voltage of 29V ensures reliable and consistent power delivery for optimal performance.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54mm, this product is compatible with standard PCB layouts and allows for efficient wiring connections.

Technical Specifications

Telephone Line ICs ML8205AE attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-45 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

29

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Nominal Supply Voltage:

29 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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