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ML8204

STMicroelectronics

ML8204 by STMicroelectronics

The STMicroelectronics ML8204 is a Telephone Line IC with 8 terminals, operating at -45 to 65 °C. It has a supply voltage of 29V and current of 4.2mA, suitable for telephone line applications. The technology used is bipolar with tin/lead terminal finish in an inline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,447 parts In-Stock

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2,447

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ABC Electronics Ltd.

UK . 2,345 parts In-Stock

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2,345

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Anansix

USA . 1,247 parts In-Stock

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1,247

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ComSIT Distribution GmbH

Germany . 1,043 parts In-Stock

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1,043

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Digiode

USA . 559 parts In-Stock

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559

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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50

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 546 parts In-Stock

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$13.950

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$12.555

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546

$13.950

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$12.555

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MKK Technologies

India . 2,278 parts In-Stock

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$26.232

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2,278

$26.232

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DigiPath Technology Company

USA . 2,278 parts In-Stock

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$26.232

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2,278

$26.232

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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A-Z Elektronik GmbH

Germany . 4,527 parts In-Stock

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4,527

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Corphita

USA . 2,256 parts In-Stock

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2,256

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Parana Technologies

USA . 1,954 parts In-Stock

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$16.679

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1,954

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$16.679

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Assy Fe

Spain . 1,000 parts In-Stock

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Epart123

USA . 710 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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200

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Overview

Elevate your telephone line applications with the ML8204 from STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics brings you a cutting-edge Telephone Line IC that offers unmatched performance and functionality. Whether you're in need of enhanced connectivity or improved signal processing, this product delivers exceptional value and benefits to customers. Trust STMicroelectronics to provide you with innovative solutions for your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to shocks and thermal stress, making it a reliable choice for long-term use.

Power Supplies (V): 29

Operating at 29V allows for sufficient power for the device to function efficiently without overloading.

No. of Terminals: 8

Having 8 terminals provides enough connections for various functions and interfaces, making it versatile in a telephone line application.

Maximum Operating Temperature: 65 °C

With a maximum operating temperature of 65 °C, this telephone line IC can withstand high temperatures without compromising performance.

Technology: BIPOLAR

The use of bipolar technology ensures reliable signal processing and accurate data transmission in a telephone line application.

Technical Specifications

Telephone Line ICs ML8204 attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

No. of Terminals:

8

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-45 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

29

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

4.2 mA

Nominal Supply Voltage:

29 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

ML8204 Telecommunications trade compliance attributes, and parameters.

NSN

5962-14-458-2612, 5962144582612

NIIN

144582612

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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