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TCM1531P-00

Texas Instruments

TCM1531P-00 by Texas Instruments

TCM1531P-00 by Texas Instruments is a Telephone Ringer Circuit IC with 8 terminals in an IN-LINE package. Operating temperature range from -20°C to 70°C, suitable for commercial telecom applications. Package size of 7.62mm width and 5.08mm seated height makes it ideal for telephone line equipment.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,508 parts In-Stock

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6,508

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Digiode

USA . 3,165 parts In-Stock

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3,165

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 54 parts In-Stock

1+ parts

$14.284

100+ parts

-

1k+ parts

$14.734

10k+ parts

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54

$14.284

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$14.734

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DigiPath Technology Company

USA . 1,494 parts In-Stock

1+ parts

$15.729

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1,494

$15.729

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ChromeModa Solutions

Germany . 6,529 parts In-Stock

1+ parts

$16.050

100+ parts

$13.161

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6,529

$16.050

$13.161

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IDEA Electronic Components Group

UK . 2,269 parts In-Stock

1+ parts

$16.050

100+ parts

$15.248

1k+ parts

$14.445

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2,269

$16.050

$15.248

$14.445

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AZTECH Wire

Italy . 886 parts In-Stock

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$18.341

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886

$18.341

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Semicontronic

India . 687 parts In-Stock

1+ parts

$47.000

100+ parts

$45.825

1k+ parts

$45.590

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687

$47.000

$45.825

$45.590

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One Stop Electronics

USA . 693 parts In-Stock

1+ parts

$376.000

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693

$376.000

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Ampacity Inc.

Singapore . 1,261 parts In-Stock

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$696.000

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1,261

$696.000

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Corphita

USA . 4,039 parts In-Stock

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4,039

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Corohmni

South Africa . 310 parts In-Stock

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Overview

Upgrade your telephone line with the TCM1531P-00 by Texas Instruments, a top-quality Telephone Ringer Circuit designed to enhance communication capabilities. Known for their reliability and innovation, Texas Instruments delivers cutting-edge solutions for various applications in the telecom industry. With its durable design and wide temperature range, this product ensures seamless operation even in challenging conditions. Experience the value of superior performance and efficiency with the TCM1531P-00, a must-have for any telecommunications setup.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for long-term use.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, allowing for versatile configuration and compatibility with various setups.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments, ensuring stable performance.

Terminal Position: DUAL

The dual terminal position enhances connectivity and provides redundancy, increasing reliability and ensuring uninterrupted communication.

Width: 7.62 mm

The compact width of 7.62 mm allows for space-efficient installation, making it suitable for applications with limited space constraints.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures compatibility with standard operating conditions, making it suitable for a wide range of commercial applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies installation and soldering processes, making it user-friendly and convenient for assembly.

Telecom IC Type: TELEPHONE RINGER CIRCUIT

Designed specifically for telephone ringer circuits, this product offers optimized performance and functionality for telecommunication applications.

Technical Specifications

Telephone Line ICs TCM1531P-00 attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM1531P-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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