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L3936AD

STMicroelectronics

L3936AD by STMicroelectronics

L3936AD by STMicroelectronics is a Telephone Line IC with 28 terminals, operating at 3V. It features a small outline package style, Gull Wing terminal form, and is designed for telecom applications. With a temperature range of -25 to 75 °C, it offers reliable performance in commercial extended environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,510

-

-

-

-

Digiode

USA . 1,634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,634

-

-

-

-

Anansix

USA . 1,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,626

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 765 parts In-Stock

1+ parts

$8.263

100+ parts

-

1k+ parts

$7.437

10k+ parts

-

765

$8.263

-

$7.437

-

MKK Technologies

India . 1,813 parts In-Stock

1+ parts

$15.539

100+ parts

-

1k+ parts

-

10k+ parts

-

1,813

$15.539

-

-

-

DigiPath Technology Company

USA . 1,813 parts In-Stock

1+ parts

$15.539

100+ parts

-

1k+ parts

-

10k+ parts

-

1,813

$15.539

-

-

-

Parana Technologies

USA . 1,770 parts In-Stock

1+ parts

-

100+ parts

$9.880

1k+ parts

-

10k+ parts

-

1,770

-

$9.880

-

-

Corphita

USA . 740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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740

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-

-

-

Overview

Upgrade your telephone line communication with the L3936AD from STMicroelectronics, a leading manufacturer known for top-quality products. Designed for various applications in the Telephone Line ICs category, this small outline package offers a range of benefits including reliable performance, easy installation, and enhanced functionality. With a nominal supply voltage of 3V and commercial extended temperature grade, this TELEPHONE MULTIFUNCTION CIRCUIT is the perfect solution for your telecom needs. Trust STMicroelectronics to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the internal components of the IC, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and labor costs.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design that can easily fit into tight spaces on the circuit board.

Power Supplies (V): 3

Operating at a low voltage of 3V helps in reducing power consumption and making the IC more energy-efficient.

No. of Terminals: 28

Higher number of terminals allow for more connectivity options and functionality in the IC.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and contributes to a more streamlined design.

Maximum Operating Temperature: 75 °C

High maximum operating temperature ensures reliable performance even in elevated temperature environments.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows the IC to function effectively in colder conditions as well.

Terminal Finish: TIN LEAD

Tin lead finish provides good conductivity and solderability for secure connections on the terminals.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options and improves overall functionality of the IC.

Maximum Seated Height: 2.65 mm

Low maximum seated height contributes to a more compact and space-efficient design.

Width: 7.5 mm

Narrow width allows for easy integration into various circuit board layouts.

Length: 17.9 mm

Compact length ensures the IC can fit into smaller spaces on the circuit board without compromising functionality.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures stable operation over a wide range of temperature conditions, suitable for various applications.

Technology: BIPOLAR

Bipolar technology offers high performance and reliability, making the IC suitable for demanding telecom applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering during installation.

Telecom IC Type: TELEPHONE MULTIFUNCTION CIRCUIT

Multifunction circuit type offers a range of capabilities for telephone applications, making the IC versatile and suitable for various telecom needs.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 1.27 mm

Small terminal pitch allows for high-density packaging and efficient use of space on the circuit board.

Make-break Ratio: 1:1.5

Make-break ratio of 1:1.5 ensures reliable switching capabilities, essential for telephone line applications.

Technical Specifications

Telephone Line ICs L3936AD attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

17.9 mm

Make-break Ratio:

1:1.5

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

L3936AD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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