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L3926AN

STMicroelectronics

L3926AN by STMicroelectronics

STMicroelectronics L3926AN is a Telephone Line IC with 28 terminals, operating at 3V. It features PLASTIC/EPOXY package, -25 to 75 °C temp range, and BIPOLAR tech. Ideal for TELEPHONE MULTIFUNCTION CIRCUIT applications due to its IN-LINE style and TIN LEAD finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,572 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,572

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Digiode

USA . 1,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,154

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Vyrian

USA . 126 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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126

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 758 parts In-Stock

1+ parts

$8.656

100+ parts

-

1k+ parts

$7.791

10k+ parts

-

758

$8.656

-

$7.791

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MKK Technologies

India . 2,118 parts In-Stock

1+ parts

$16.278

100+ parts

-

1k+ parts

-

10k+ parts

-

2,118

$16.278

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DigiPath Technology Company

USA . 2,118 parts In-Stock

1+ parts

$16.278

100+ parts

-

1k+ parts

-

10k+ parts

-

2,118

$16.278

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-

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Corphita

USA . 3,236 parts In-Stock

1+ parts

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100+ parts

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3,236

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Parana Technologies

USA . 1,710 parts In-Stock

1+ parts

-

100+ parts

$10.350

1k+ parts

-

10k+ parts

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1,710

-

$10.350

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Overview

Discover the unparalleled quality and reliability of the L3926AN by STMicroelectronics, a leading manufacturer in the industry. This Telephone Line IC offers a wide range of applications, providing exceptional value and benefits to customers. With its innovative technology and superior performance, this product ensures seamless communication and efficiency. Trust STMicroelectronics for top-notch solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good durability and insulation, making the product suitable for long-term use in various environments.

Power Supplies (V): 3

Operating at a power supply of 3V makes the product energy-efficient and suitable for low-power applications.

No. of Terminals: 28

With 28 terminals, the product offers versatile connectivity options, allowing for various connections and configurations.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature of 75 °C ensures reliable performance even in elevated temperature environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and solderability, ensuring secure connections and reliable performance.

Width: 15.24 mm

The compact width of 15.24mm makes the product suitable for space-constrained applications.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures that the product can operate effectively in a wide range of temperature conditions, making it versatile for different applications.

Technology: BIPOLAR

Bipolar technology offers good performance and reliability, making the product a dependable choice for telephone line applications.

Telecom IC Type: TELEPHONE MULTIFUNCTION CIRCUIT

Being a telephone multifunction circuit, the product provides various functionalities in a single IC, simplifying the design and enhancing efficiency.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V ensures compatibility with standard power sources and efficient power consumption.

Technical Specifications

Telephone Line ICs L3926AN attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

Length:

36.83 mm

Make-break Ratio:

1:1.5

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

L3926AN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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