Loading...

TAS3108DCP

Texas Instruments

TAS3108DCP by Texas Instruments

TAS3108DCP by Texas Instruments is a 38-terminal DSP with max supply voltage of 3.6V, clock frequency up to 20MHz, and RAM words of 3072. Ideal for digital signal processing applications due to its small form factor, low power mode, and internal bus architecture supporting fixed-point format operations at commercial temperature grades.

Median Price

$14.300

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,850 parts In-Stock

1+ parts

$11.491

100+ parts

$10.037

1k+ parts

$6.922

10k+ parts

-

1,850

$11.491

$10.037

$6.922

-

DigiKey

USA . 158 parts In-Stock

1+ parts

$17.110

100+ parts

$11.742

1k+ parts

$11.003

10k+ parts

-

158

$17.110

$11.742

$11.003

-

Mouser Electronics

USA . 41 parts In-Stock

1+ parts

$17.110

100+ parts

$11.740

1k+ parts

$11.000

10k+ parts

-

41

$17.110

$11.740

$11.000

-

Arrow

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$9.733

1k+ parts

-

10k+ parts

-

200

-

$9.733

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 885 parts In-Stock

1+ parts

$10.916

100+ parts

-

1k+ parts

-

10k+ parts

-

885

$10.916

-

-

-

Chip Stock

USA . 15,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,350

-

-

-

-

Vyrian

USA . 2,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,479

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

950

-

-

-

-

Bristol Electronics

USA . 950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

950

-

-

-

-

EZ Electronic Parts

Israel . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,327 parts In-Stock

1+ parts

$10.342

100+ parts

-

1k+ parts

-

10k+ parts

-

3,327

$10.342

-

-

-

Parana Technologies

USA . 161 parts In-Stock

1+ parts

$40.998

100+ parts

-

1k+ parts

-

10k+ parts

-

161

$40.998

-

-

-

Microchip USA

USA . 2,060 parts In-Stock

1+ parts

$41.100

100+ parts

$40.520

1k+ parts

$40.220

10k+ parts

$39.930

2,060

$41.100

$40.520

$40.220

$39.930

ChromeModa Solutions

Germany . 2,911 parts In-Stock

1+ parts

$46.065

100+ parts

$37.773

1k+ parts

-

10k+ parts

-

2,911

$46.065

$37.773

-

-

IDEA Electronic Components Group

UK . 186 parts In-Stock

1+ parts

$46.065

100+ parts

$43.762

1k+ parts

$41.458

10k+ parts

-

186

$46.065

$43.762

$41.458

-

Corohmni

South Africa . 947 parts In-Stock

1+ parts

$75.290

100+ parts

-

1k+ parts

-

10k+ parts

-

947

$75.290

-

-

-

Lixinc

USA . 16,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,587

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,116

-

-

-

-

Authorized Procurement Solutions

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

-

-

-

-

Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

DigiPath Technology Company

USA . 794 parts In-Stock

1+ parts

-

100+ parts

$41.532

1k+ parts

-

10k+ parts

-

794

-

$41.532

-

-

Overview

Unlock the power of advanced audio processing with the TAS3108DCP from Texas Instruments. As a leader in digital signal processors, Texas Instruments offers unmatched quality and reliability. The TAS3108DCP is perfect for a wide range of applications, providing clear sound and efficient performance. With a compact design and low power mode, this DSP delivers exceptional value to customers looking for top-notch audio solutions. Upgrade your audio experience today with the TAS3108DCP from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

The higher supply voltage allows for greater performance and processing capabilities.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to mount on a PCB.

No. of Terminals: 38

Having a higher number of terminals allows for more connections and functionalities in the device.

Minimum Supply Voltage: 3 V

A low minimum supply voltage makes the product more versatile and compatible with a range of power sources.

Maximum Operating Temperature: 70 °C

The high operating temperature range ensures reliability and stable performance in varying conditions.

Minimum Operating Temperature: 0 °C

The low operating temperature allows for use in colder environments without risk of damage.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for redundancy and improved signal integrity.

Maximum Seated Height: 1.2 mm

Low seated height enables compact designs and space-saving installations.

RAM Words: 3072

Having a larger RAM capacity enables faster data processing and multitasking capabilities.

Width: 4.4 mm

Narrow width allows for space-efficient PCB layout and integration into tight spaces.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast data processing and real-time signal processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required for reflow soldering process ensures quick and efficient manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures strong and reliable solder joints.

Internal Bus Architecture: MULTIPLE

Multiple internal buses allow for efficient data transfer and communication within the device.

Length: 9.7 mm

Compact length enables space-saving design and integration into small devices.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The specific type of peripheral IC ensures compatibility and enhanced functionality for signal processing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high performance for efficient data processing.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide mechanical stability.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and reliability.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB design and compact layouts.

Format: FIXED POINT

Fixed point format is suitable for integer arithmetic operations and efficient processing of digital signals.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the device can withstand moderate exposure to moisture during storage and handling.

Low Power Mode: YES

Low power mode feature enables energy-efficient operation and extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) TAS3108DCP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

NO

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of Terminals:

38

No. of Timers:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Words:

3072

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

TAS3108DCP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19