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TAS3103DBTG4

Texas Instruments

TAS3103DBTG4 by Texas Instruments

TAS3103DBTG4 by Texas Instruments is a 38-terminal DSP with max supply voltage of 3.6V, clock frequency up to 20MHz, and low power mode. Ideal for digital signal processing applications requiring small outline, thin profile package with shrink pitch technology. Operating temp range from 0-70°C makes it suitable for commercial-grade projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,413 parts In-Stock

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Digiode

USA . 4,581 parts In-Stock

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4,581

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Distributors (Availability)

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AZTECH Wire

Italy . 250 parts In-Stock

1+ parts

$9.218

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250

$9.218

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One Stop Electronics

USA . 150 parts In-Stock

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$13.000

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$13.000

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Parana Technologies

USA . 891 parts In-Stock

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$65.792

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891

$65.792

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Corohmni

South Africa . 61 parts In-Stock

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$66.169

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61

$66.169

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DigiPath Technology Company

USA . 1,122 parts In-Stock

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$72.446

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1,122

$72.446

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ChromeModa Solutions

Germany . 5,942 parts In-Stock

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$73.924

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$60.618

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5,942

$73.924

$60.618

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IDEA Electronic Components Group

UK . 705 parts In-Stock

1+ parts

$73.924

100+ parts

$70.228

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$66.532

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705

$73.924

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$66.532

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Microchip USA

USA . 4,670 parts In-Stock

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Corphita

USA . 291 parts In-Stock

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Overview

Experience the next level of digital signal processing with the TAS3103DBTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that guarantee reliability and performance. The TAS3103DBTG4 falls under the category of Digital Signal Processors (DSPs) and offers a wide range of applications. From audio processing to telecommunications, this versatile product provides unmatched value to customers. With a maximum clock frequency of 20 MHz and low power mode, you can trust this DSP to meet your needs efficiently. Upgrade your projects with the TAS3103DBTG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring long-term performance and reliability.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications and power requirements, making the DSP versatile and adaptable.

Package Shape: RECTANGULAR

Optimizes space utilization on the circuit board, enabling efficient placement alongside other components.

No. of Terminals: 38

Provides ample connectivity options for interfacing with other devices, enhancing the DSP's functionality.

Minimum Supply Voltage: 3 V

Ensures compatibility with various power sources, offering flexibility in different operating environments.

Maximum Operating Temperature: 70 °C

Allows the DSP to function reliably in a wide range of temperature conditions, enhancing its robustness and performance.

Minimum Operating Temperature: 0 °C

Ensures the DSP can operate in cold environments without compromising its functionality, making it suitable for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring stable connections and long-term performance of the DSP.

Terminal Position: DUAL

Enhances signal transmission efficiency and reduces crosstalk between terminals, improving overall performance of the DSP.

Maximum Seated Height: 1.2 mm

Enables low-profile design of the DSP, facilitating compact integration into space-constrained electronic devices.

Width: 4.4 mm

Compact size allows for efficient placement on the circuit board, optimizing layout and reducing overall system footprint.

Maximum Clock Frequency: 20 MHz

Provides high-speed processing capabilities, enabling rapid data processing and real-time signal analysis.

Peat Reflow Temperature: 260 °C

Withstands high-temperature soldering processes, ensuring reliable solder joints during manufacturing and assembly.

Technology: CMOS

Offers low power consumption and high noise immunity, extending battery life and enhancing overall performance efficiency.

Nominal Supply Voltage: 3.3 V

Stable voltage supply ensures consistent and reliable operation of the DSP, improving system performance and reliability.

Terminal Pitch: 0.5 mm

Fine pitch facilitates high-density mounting on circuit boards, enabling compact design and efficient use of space.

Moisture Sensitivity Level (MSL): 2

Indicates the level of protection against moisture damage, ensuring the DSP's resilience in humid or damp conditions.

Low Power Mode: YES

Enables energy-efficient operation, reducing power consumption and extending battery life in portable or battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TAS3103DBTG4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

NO

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

38

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

TAS3103DBTG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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