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TAS3103DBTRG4

Texas Instruments

TAS3103DBTRG4 by Texas Instruments

TAS3103DBTRG4 by Texas Instruments is a 38-terminal DSP with max supply voltage of 3.6V, clock frequency up to 20MHz, and low power mode. Ideal for digital signal processing applications requiring small outline package with thin profile and shrink pitch design.

Median Price

$10.372

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,425 parts In-Stock

1+ parts

-

100+ parts

$9.220

1k+ parts

$8.250

10k+ parts

$7.760

5,425

-

$9.220

$8.250

$7.760

Verical

USA . 5,425 parts In-Stock

1+ parts

-

100+ parts

$11.525

1k+ parts

$10.313

10k+ parts

$9.700

5,425

-

$11.525

$10.313

$9.700

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 222 parts In-Stock

1+ parts

$6.090

100+ parts

-

1k+ parts

-

10k+ parts

-

222

$6.090

-

-

-

Vyrian

USA . 4,451 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,451

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,426 parts In-Stock

1+ parts

$5.769

100+ parts

-

1k+ parts

-

10k+ parts

-

3,426

$5.769

-

-

-

Parana Technologies

USA . 1,217 parts In-Stock

1+ parts

$54.939

100+ parts

-

1k+ parts

-

10k+ parts

-

1,217

$54.939

-

-

-

DigiPath Technology Company

USA . 1,942 parts In-Stock

1+ parts

$60.494

100+ parts

$55.655

1k+ parts

-

10k+ parts

-

1,942

$60.494

$55.655

-

-

ChromeModa Solutions

Germany . 5,885 parts In-Stock

1+ parts

$61.729

100+ parts

$50.618

1k+ parts

-

10k+ parts

-

5,885

$61.729

$50.618

-

-

IDEA Electronic Components Group

UK . 935 parts In-Stock

1+ parts

$61.729

100+ parts

$58.643

1k+ parts

$55.556

10k+ parts

-

935

$61.729

$58.643

$55.556

-

Corohmni

South Africa . 285 parts In-Stock

1+ parts

$62.226

100+ parts

-

1k+ parts

-

10k+ parts

-

285

$62.226

-

-

-

Microchip USA

USA . 4,427 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,427

-

-

-

-

Overview

Unlock the power of digital signal processing with the TAS3103DBTRG4 by Texas Instruments. Crafted with precision and expertise, this DSP offers unparalleled quality and reliability. Ideal for a wide range of applications, this compact and versatile device provides customers with exceptional value, benefits, and advantages. Enhance your projects with cutting-edge technology and superior performance, all in a small outline package that delivers big results. Experience the difference with the TAS3103DBTRG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the DSP, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, providing flexibility in power requirements for different systems.

Package Shape: RECTANGULAR

Rectangular package shape allows for compact and efficient board layout, maximizing space utilization in electronic devices.

No. of Terminals: 38

Higher number of terminals enable connectivity to various components and peripherals, expanding the functionality of the DSP.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments, making it suitable for a wide range of applications and conditions.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency allows for fast processing of signals and data, enhancing the performance of the DSP.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Technical Specifications

Digital Signal Processors (DSPs) TAS3103DBTRG4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

NO

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of Terminals:

38

No. of Timers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

TAS3103DBTRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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