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TAS3103IDBTRG4

Texas Instruments

TAS3103IDBTRG4 by Texas Instruments

TAS3103IDBTRG4 by Texas Instruments is a 38-terminal DSP in small outline package. With CMOS technology, it has 0.5mm terminal pitch and 1.2mm seated height. Ideal for industrial applications requiring digital signal processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,408 parts In-Stock

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Digiode

USA . 1,416 parts In-Stock

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1,416

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Distributors (Availability)

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AZTECH Wire

Italy . 862 parts In-Stock

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$11.809

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862

$11.809

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Parana Technologies

USA . 335 parts In-Stock

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$20.759

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$20.904

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335

$20.759

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$20.904

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ChromeModa Solutions

Germany . 6,403 parts In-Stock

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$23.325

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$19.126

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6,403

$23.325

$19.126

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IDEA Electronic Components Group

UK . 1,134 parts In-Stock

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$23.325

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$22.159

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$20.992

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1,134

$23.325

$22.159

$20.992

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One Stop Electronics

USA . 1,073 parts In-Stock

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$33.000

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1,073

$33.000

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Corohmni

South Africa . 935 parts In-Stock

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$67.243

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935

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Corphita

USA . 1,381 parts In-Stock

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Microchip USA

USA . 295 parts In-Stock

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DigiPath Technology Company

USA . 201 parts In-Stock

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$21.030

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Overview

Experience superior sound quality and unparalleled performance with the TAS3103IDBTRG4 by Texas Instruments, a leading manufacturer in the digital signal processor category. This cutting-edge device offers endless possibilities for audio processing applications, delivering premium sound output and unmatched reliability. Elevate your audio experience with the TAS3103IDBTRG4 and enjoy the benefits of top-notch quality and advanced technology, all in a compact and user-friendly package. Unlock a world of possibilities and take your audio projects to the next level with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and convenient assembly onto circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 38

With 38 terminals, this DSP provides a wide range of connectivity options for versatile integration into different systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design of the package make it space-saving and efficient for densely populated PCB layouts.

Terminal Position: DUAL

Dual terminal position enhances stability and connectivity, ensuring reliable performance in demanding industrial applications.

Maximum Seated Height: 1.2 mm

Low profile with a maximum seated height of 1.2 mm allows for slim and compact device designs.

Width: 4.4 mm

With a width of 4.4 mm, this DSP can fit into narrow spaces, making it suitable for applications with limited board real estate.

Length: 9.7 mm

The 9.7 mm length provides a balance between compactness and functionality, making it versatile for various design requirements.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of this DSP offers advanced digital signal processing capabilities along with additional functionalities, enhancing its versatility.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making this DSP energy-efficient and suitable for demanding processing tasks.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections, ensuring a reliable electrical connection for optimal performance.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm allows for closer spacing of terminals, enabling higher pin counts in a compact package.

Technical Specifications

Digital Signal Processors (DSPs) TAS3103IDBTRG4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G38

Length:

9.7 mm

No. of Terminals:

38

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

TAS3103IDBTRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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