Loading...

TAS3103IDBT

Texas Instruments

TAS3103IDBT by Texas Instruments

TAS3103IDBT by Texas Instruments is a 38-terminal DSP in small outline package with CMOS technology. It features nickel palladium gold finish, 0.5mm terminal pitch, and industrial temperature grade. Ideal for digital signal processing applications requiring compact design and high performance.

Median Price

$4.830

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,600 parts In-Stock

1+ parts

-

100+ parts

$4.830

1k+ parts

-

10k+ parts

-

4,600

-

$4.830

-

-

Rochester

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

$4.170

1k+ parts

$3.730

10k+ parts

$3.510

2,400

-

$4.170

$3.730

$3.510

Verical

USA . 1,400 parts In-Stock

1+ parts

-

100+ parts

$5.213

1k+ parts

$4.662

10k+ parts

$4.388

1,400

-

$5.213

$4.662

$4.388

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,586 parts In-Stock

1+ parts

$4.408

100+ parts

-

1k+ parts

-

10k+ parts

-

1,586

$4.408

-

-

-

Vyrian

USA . 1,163 parts In-Stock

1+ parts

$4.640

100+ parts

-

1k+ parts

-

10k+ parts

-

1,163

$4.640

-

-

-

DigiKey Marketplace

USA . 4,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,600

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,366 parts In-Stock

1+ parts

$4.176

100+ parts

-

1k+ parts

-

10k+ parts

-

1,366

$4.176

-

-

-

Corohmni

South Africa . 3,222 parts In-Stock

1+ parts

$32.041

100+ parts

-

1k+ parts

-

10k+ parts

-

3,222

$32.041

-

-

-

Parana Technologies

USA . 2,216 parts In-Stock

1+ parts

$67.004

100+ parts

-

1k+ parts

-

10k+ parts

-

2,216

$67.004

-

-

-

IDEA Electronic Components Group

UK . 2,010 parts In-Stock

1+ parts

$75.285

100+ parts

$71.521

1k+ parts

$67.756

10k+ parts

-

2,010

$75.285

$71.521

$67.756

-

ChromeModa Solutions

Germany . 1,907 parts In-Stock

1+ parts

$75.285

100+ parts

$61.734

1k+ parts

-

10k+ parts

-

1,907

$75.285

$61.734

-

-

Kepictronics

USA . 4,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,600

-

-

-

-

DigiPath Technology Company

USA . 2,035 parts In-Stock

1+ parts

-

100+ parts

$67.877

1k+ parts

-

10k+ parts

-

2,035

-

$67.877

-

-

Microchip USA

USA . 147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

147

-

-

-

-

Overview

Enhance your audio experience with the TAS3103IDBT from Texas Instruments, a leading manufacturer known for high-quality digital signal processors. Designed for a wide range of applications, this compact and versatile device offers unparalleled performance and reliability. With its advanced technology and industrial-grade components, the TAS3103IDBT delivers exceptional sound quality and functionality, making it the perfect choice for audio enthusiasts and professionals alike. Upgrade your audio system today and enjoy the benefits of superior sound processing with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good insulation and protection for the internal circuitry.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic devices, making this product easier to integrate into a design.

Package Shape: RECTANGULAR

Rectangular shape provides a compact and space-efficient form factor for the DSP, making it suitable for applications with limited space.

No. of Terminals: 38

Having a higher number of terminals allows for more connectivity options and functionality, making this DSP versatile in various applications.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a smaller footprint, thinner profile, and tighter terminal pitch, which can be beneficial for space-constrained designs and high-density applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides good conductivity, corrosion resistance, and reliability, ensuring stable connections and performance over time.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, this DSP is suitable for use in harsh environments and industrial applications.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology offers low power consumption and high efficiency, making this DSP energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections and reliable performance.

Moisture Sensitivity Level (MSL): 2

This level of moisture sensitivity indicates that the DSP has a moderate tolerance to moisture exposure during assembly and storage, ensuring its reliability.

Technical Specifications

Digital Signal Processors (DSPs) TAS3103IDBT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

38

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

TAS3103IDBT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19