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TAS3108IADCPG4

Texas Instruments

TAS3108IADCPG4 by Texas Instruments

TAS3108IADCPG4 by Texas Instruments is a 38-terminal DSP with max supply voltage of 3.6V, clock frequency up to 20MHz, and RAM words of 3072. Ideal for industrial applications requiring low power consumption and fixed-point format processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,941 parts In-Stock

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Digiode

USA . 1,287 parts In-Stock

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One Stop Electronics

USA . 689 parts In-Stock

1+ parts

$6.000

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689

$6.000

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AZTECH Wire

Italy . 841 parts In-Stock

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$16.787

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841

$16.787

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Corohmni

South Africa . 239 parts In-Stock

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$25.111

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$25.111

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Parana Technologies

USA . 347 parts In-Stock

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$58.293

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347

$58.293

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DigiPath Technology Company

USA . 1,791 parts In-Stock

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$64.188

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$59.053

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$64.188

$59.053

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ChromeModa Solutions

Germany . 1,097 parts In-Stock

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$65.498

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$53.708

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$65.498

$53.708

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IDEA Electronic Components Group

UK . 802 parts In-Stock

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$65.498

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$62.223

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$58.948

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802

$65.498

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$58.948

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Corphita

USA . 4,516 parts In-Stock

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Microchip USA

USA . 2,877 parts In-Stock

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Overview

Experience superior audio processing with the TAS3108IADCPG4 by Texas Instruments. As a leading manufacturer of high-quality Digital Signal Processors (DSPs), Texas Instruments delivers cutting-edge technology for a wide range of applications. This DSP offers unmatched value, benefits, and advantages to customers, ensuring optimal performance and efficiency. Upgrade your audio systems with the TAS3108IADCPG4 and enjoy top-notch sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and resistance to damage, ensuring the product is long-lasting.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, providing flexibility and compatibility with a variety of systems.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and alignment in circuit designs.

No. of Terminals: 38

Plenty of terminals for connectivity options and interface with other components.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Combination of features like small outline, heat sink, thin profile, and shrink pitch make the product versatile and suitable for various applications.

Minimum Supply Voltage: 3 V

Ability to operate at low voltages helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 105 °C

High operating temperature range ensures reliable performance in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold finish provides corrosion resistance and ensures good connectivity.

RAM Words: 3072

Ample RAM capacity for processing and storing data efficiently.

Width: 4.4 mm

Compact width saves space on the circuit board, enabling more components to be included in the design.

Maximum Clock Frequency: 20 MHz

High clock frequency allows for fast signal processing and execution of tasks.

Internal Bus Architecture: MULTIPLE

Multiple internal buses enable efficient data transfer and communication between different parts of the processor.

Length: 9.7 mm

Optimal length for fitting into compact electronic devices without compromising on performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and stability in demanding operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated digital signal processing capabilities along with additional peripheral functionalities provide versatility in applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation for efficient signal processing.

Terminal Form: GULL WING

Gull wing terminals provide mechanical stability and easy soldering during assembly.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for dense packing of terminals, increasing connectivity options in a limited space.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances efficiency in digital signal processing tasks.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity, suitable for handling in typical manufacturing environments.

Low Power Mode: YES

Low power mode enables power-saving operation when full processing power is not required, enhancing energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TAS3108IADCPG4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

NO

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of Terminals:

38

No. of Timers:

0

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Words:

3072

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

TAS3108IADCPG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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