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TAS3103ADBTRG4

Texas Instruments

TAS3103ADBTRG4 by Texas Instruments

TAS3103ADBTRG4 by Texas Instruments is a 38-terminal DSP in small outline package with nickel palladium gold finish. It features CMOS technology, 260°C peak reflow temp, and 1.2mm seated height. Ideal for commercial applications requiring digital signal processing capabilities in compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,408 parts In-Stock

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Digiode

USA . 160 parts In-Stock

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160

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One Stop Electronics

USA . 768 parts In-Stock

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$12.000

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768

$12.000

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AZTECH Wire

Italy . 692 parts In-Stock

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$18.597

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Corohmni

South Africa . 5,031 parts In-Stock

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$51.705

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Parana Technologies

USA . 614 parts In-Stock

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$59.228

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614

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ChromeModa Solutions

Germany . 874 parts In-Stock

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$66.548

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$54.569

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874

$66.548

$54.569

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IDEA Electronic Components Group

UK . 317 parts In-Stock

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$66.548

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$63.221

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$59.893

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317

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$59.893

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Corphita

USA . 4,111 parts In-Stock

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DigiPath Technology Company

USA . 1,910 parts In-Stock

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Microchip USA

USA . 206 parts In-Stock

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Overview

Elevate your audio experience with the TAS3103ADBTRG4 from Texas Instruments. As a leader in digital signal processors (DSPs), Texas Instruments delivers top-quality products that are designed to enhance sound performance in a variety of applications. Whether you're looking to improve the audio quality of your home entertainment system or take your car stereo to the next level, this compact and versatile DSP offers unmatched value and benefits. Upgrade your sound system today with the TAS3103ADBTRG4 and enjoy crystal-clear audio like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and allows for easy integration into electronic devices.

No. of Terminals: 38

With a high number of terminals, this DSP can accommodate multiple connections and interfaces, enhancing its functionality.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile of the package save space on the PCB and make it suitable for compact electronic devices.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring stable performance over time.

Maximum Seated Height: 1.2 mm

The low seated height allows for a slim design and easy integration into devices with space constraints.

Width: 4.4 mm

The compact width of the DSP package enables efficient PCB layout and saves space in the overall system design.

Maximum Time At Peak Reflow Temperature: 30s

The short time at peak reflow temperature minimizes the risk of thermal damage during manufacturing processes.

Peak Reflow Temperature: 260C

The high peak reflow temperature ensures reliable solder joints and overall product durability.

Length: 9.7 mm

The moderate length of the DSP package provides a good balance between space efficiency and functionality.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the DSP is suitable for standard operating conditions in commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The digital signal processor type indicates that the product is optimized for processing digital signals efficiently, making it ideal for various signal processing applications.

Technology: CMOS

The CMOS technology provides low power consumption and high-speed processing capabilities, enhancing the overall performance of the DSP.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and reliable electrical connections, ensuring robust performance in demanding environments.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting on the PCB, making the DSP suitable for compact electronic designs.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that the DSP is moderately sensitive to moisture, requiring standard handling procedures for moisture protection during storage and assembly.

Technical Specifications

Digital Signal Processors (DSPs) TAS3103ADBTRG4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

38

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

TAS3103ADBTRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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