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SNM54248J

Texas Instruments

SNM54248J by Texas Instruments

SNM54248J by Texas Instruments is a MIL-STD-883 Class C screened TTL decoder & driver with 16 terminals in an in-line package. It operates b/w -55°C to 125°C, making it suitable for military-grade applications requiring high temperature tolerance and reliability. The ceramic package body material ensures durability and robust performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,754 parts In-Stock

1+ parts

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8,754

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Digiode

USA . 3,522 parts In-Stock

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3,522

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 397 parts In-Stock

1+ parts

$19.315

100+ parts

-

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397

$19.315

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Parana Technologies

USA . 1,248 parts In-Stock

1+ parts

$29.852

100+ parts

-

1k+ parts

$64.034

10k+ parts

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1,248

$29.852

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$64.034

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DigiPath Technology Company

USA . 1,057 parts In-Stock

1+ parts

$32.871

100+ parts

$30.241

1k+ parts

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10k+ parts

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1,057

$32.871

$30.241

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ChromeModa Solutions

Germany . 3,133 parts In-Stock

1+ parts

$33.542

100+ parts

$27.504

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3,133

$33.542

$27.504

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IDEA Electronic Components Group

UK . 2,266 parts In-Stock

1+ parts

$33.542

100+ parts

$31.865

1k+ parts

$30.188

10k+ parts

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2,266

$33.542

$31.865

$30.188

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One Stop Electronics

USA . 1,479 parts In-Stock

1+ parts

$65.000

100+ parts

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1,479

$65.000

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Corphita

USA . 888 parts In-Stock

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888

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Overview

Unlock the power of precision and reliability with the SNM54248J by Texas Instruments. Crafted with superior quality and expertise, this decoder and driver offers unparalleled performance for military-grade applications. With its MIL-STD-883 Class C screening level and rugged ceramic package body material, this product ensures durability and longevity in extreme conditions. Trust in Texas Instruments to deliver cutting-edge technology that guarantees optimal functionality and seamless integration. Elevate your projects with the SNM54248J and experience the difference of excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package provides excellent thermal conductivity and durability, ensuring the product can withstand high temperatures and harsh environments.

Screening Level: MIL-STD-883 Class C

The MIL-STD-883 Class C screening level ensures that the product meets rigorous military standards for reliability and performance.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and compatibility with a wide range of systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in extreme heat conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures the product can operate in freezing cold environments without any issues.

Technology: TTL

The TTL technology offers fast response times and low power consumption, making the product efficient and reliable for various applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure mounting and soldering connections, ensuring stability and durability in operation.

Technical Specifications

Decoder & Drivers SNM54248J attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class C

Sub-Category:

Decoder/Drivers

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNM54248J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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