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SNM5446AW

Texas Instruments

SNM5446AW by Texas Instruments

SNM5446AW by Texas Instruments is a MIL-STD-883 Class C rated TTL decoder & driver with 16 terminals, operating b/w -55°C to 125°C. It has a nominal voltage of 5V and is designed for military applications requiring high reliability in harsh environments. The package is ceramic, surface mountable, rectangular in shape, and features a flat terminal form with a pitch of 1.27mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,772 parts In-Stock

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2,772

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Vyrian

USA . 2,143 parts In-Stock

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2,143

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 28 parts In-Stock

1+ parts

$10.660

100+ parts

-

1k+ parts

$11.150

10k+ parts

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28

$10.660

-

$11.150

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DigiPath Technology Company

USA . 290 parts In-Stock

1+ parts

$11.738

100+ parts

$10.799

1k+ parts

-

10k+ parts

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290

$11.738

$10.799

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ChromeModa Solutions

Germany . 3,252 parts In-Stock

1+ parts

$11.978

100+ parts

$9.822

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3,252

$11.978

$9.822

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IDEA Electronic Components Group

UK . 220 parts In-Stock

1+ parts

$11.978

100+ parts

$11.379

1k+ parts

$10.780

10k+ parts

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220

$11.978

$11.379

$10.780

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AZTECH Wire

Italy . 587 parts In-Stock

1+ parts

$13.080

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587

$13.080

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One Stop Electronics

USA . 313 parts In-Stock

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$65.000

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313

$65.000

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Corphita

USA . 1,874 parts In-Stock

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1,874

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Overview

Elevate your electronic projects with the SNM5446AW by Texas Instruments, a top-tier decoder & driver that offers unparalleled quality and reliability. Crafted from durable ceramic materials and meeting MIL-STD-883 Class C screening levels, this rectangular flatpack package boasts a wide range of applications in military-grade technology. With a nominal supply voltage of 5V and dual terminal positions, this TTL technology device is built to withstand extreme temperatures from -55°C to 125°C. Trust Texas Instruments for cutting-edge solutions that deliver exceptional performance and value for all your decoding and driving needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its durability and resistance to high temperatures, making this decoder & driver reliable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly, saving space and enabling easier integration into electronic systems.

Screening Level: MIL-STD-883 Class C

Meeting MIL-STD-883 Class C standards ensures high reliability and quality in harsh environments, ideal for military or aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

A 5V nominal supply voltage is common and widely compatible, suitable for various electronic circuits and systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this decoder & driver can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: -55 °C

The ability to operate in temperatures as low as -55°C makes this product suitable for a wide range of environments and conditions.

Technology: TTL

TTL technology offers high speed and low power consumption, making this decoder & driver efficient and reliable in digital circuits.

Technical Specifications

Decoder & Drivers SNM5446AW attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class C

Sub-Category:

Decoder/Drivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNM5446AW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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