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SNM54246W

Texas Instruments

SNM54246W by Texas Instruments

SNM54246W by Texas Instruments is a MIL-STD-883 Class C screened TTL decoder & driver with 16 terminals in a ceramic flatpack package. It operates b/w -55°C to 125°C, making it suitable for military-grade applications requiring high temperature tolerance and reliability. The surface-mountable rectangular package design with dual terminal position offers versatility in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,373 parts In-Stock

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Digiode

USA . 2,517 parts In-Stock

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2,517

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Distributors (Availability)

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One Stop Electronics

USA . 948 parts In-Stock

1+ parts

$10.000

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948

$10.000

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AZTECH Wire

Italy . 759 parts In-Stock

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$19.039

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759

$19.039

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Parana Technologies

USA . 1,099 parts In-Stock

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$26.508

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$27.088

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1,099

$26.508

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$27.088

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ChromeModa Solutions

Germany . 5,660 parts In-Stock

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$29.784

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$24.423

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5,660

$29.784

$24.423

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IDEA Electronic Components Group

UK . 442 parts In-Stock

1+ parts

$29.784

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$28.295

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$26.806

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442

$29.784

$28.295

$26.806

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Corphita

USA . 3,271 parts In-Stock

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DigiPath Technology Company

USA . 652 parts In-Stock

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$26.853

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652

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$26.853

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Overview

Unlock the power of precision with the SNM54246W by Texas Instruments. This top-quality decoder and driver offers unparalleled reliability and performance, thanks to its MIL-STD-883 Class C screening level. Ideal for military-grade applications, this product boasts a rugged ceramic body and a wide operating temperature range from -55°C to 125°C. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the SNM54246W and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides better thermal conductivity and mechanical strength, ensuring reliability and durability in harsh operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing manufacturing costs.

Screening Level: MIL-STD-883 Class C

Meeting MIL-STD-883 Class C ensures high reliability and quality, making this decoder & driver suitable for critical military applications.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy integration into circuit designs and provides a compact form factor for space-constrained applications.

No. of Terminals: 16

With 16 terminals, this decoder & driver offers versatile connectivity options for interfacing with other components and systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this decoder & driver can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: -55 °C

The wide operating temperature range allows this decoder & driver to function reliably in extreme cold environments.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connecting the decoder & driver to external circuitry.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this decoder & driver is rugged and reliable for use in demanding defense applications.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making this decoder & driver suitable for high-performance applications.

Terminal Form: FLAT

Flat terminal form factor simplifies assembly and ensures secure connections with external components for reliable operation.

Terminal Pitch: 1.27 mm

With a small terminal pitch, this decoder & driver allows for high-density mounting on PCBs, saving space and enhancing circuit design flexibility.

Technical Specifications

Decoder & Drivers SNM54246W attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class C

Sub-Category:

Decoder/Drivers

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNM54246W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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