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SNM54247W

Texas Instruments

SNM54247W by Texas Instruments

SNM54247W by Texas Instruments is a MIL-STD-883 Class C screened TTL decoder & driver with 16 terminals in a ceramic flatpack package. It operates b/w -55°C to 125°C, making it suitable for military-grade applications requiring high temperature tolerance and reliability. The surface-mount design and rectangular shape offer space-efficient integration in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,501 parts In-Stock

1+ parts

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5,501

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Digiode

USA . 4,772 parts In-Stock

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4,772

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 840 parts In-Stock

1+ parts

$12.860

100+ parts

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840

$12.860

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One Stop Electronics

USA . 828 parts In-Stock

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$20.000

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828

$20.000

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Parana Technologies

USA . 958 parts In-Stock

1+ parts

$21.461

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$21.834

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958

$21.461

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$21.834

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DigiPath Technology Company

USA . 392 parts In-Stock

1+ parts

$23.632

100+ parts

$21.741

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392

$23.632

$21.741

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ChromeModa Solutions

Germany . 5,416 parts In-Stock

1+ parts

$24.114

100+ parts

$19.773

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5,416

$24.114

$19.773

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IDEA Electronic Components Group

UK . 1,908 parts In-Stock

1+ parts

$24.114

100+ parts

$22.908

1k+ parts

$21.703

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1,908

$24.114

$22.908

$21.703

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Corphita

USA . 3,029 parts In-Stock

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3,029

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Overview

Discover the cutting-edge SNM54247W by Texas Instruments, a high-quality decoder & driver that exceeds expectations. Manufactured with precision and expertise, this product offers unparalleled reliability and performance in a variety of applications. From military to industrial use, this versatile device provides superior value and benefits to customers looking for top-of-the-line technology. Experience the advantages of Texas Instruments with the SNM54247W, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic material provides excellent thermal conductivity and durability, making it suitable for high temperature applications and ensuring reliable performance.

Surface Mount: YES

The surface mount design allows for easy installation on printed circuit boards, saving space and making assembly more efficient.

Screening Level: MIL-STD-883 Class C

This high screening level ensures quality and reliability, meeting stringent military standards for performance and durability.

Package Shape: RECTANGULAR

The rectangular shape allows for a compact and space-saving design, ideal for applications where size is a crucial factor.

No. of Terminals: 16

With 16 terminals, this decoder and driver offers versatility and compatibility with a wide range of devices and systems.

Package Style (Meter): FLATPACK

The flatpack style offers a low-profile and space-saving package, making it suitable for applications where height constraints are a concern.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in challenging environments, ensuring the product's longevity and durability.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this decoder and driver can withstand cold conditions, making it suitable for a wide range of operating environments.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connection options, allowing for easier integration into existing systems.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this decoder and driver offers robust performance and reliability, making it ideal for demanding applications.

Technology: TTL

Utilizing TTL technology, this decoder and driver ensures fast and accurate signal processing, making it suitable for applications requiring precise timing and control.

Terminal Form: FLAT

The flat terminal form simplifies the soldering and connection process, ensuring a secure and reliable electrical connection.

Terminal Pitch: 1.27 mm

With a small terminal pitch, this decoder and driver allows for denser packing of components on the circuit board, maximizing space efficiency.

Technical Specifications

Decoder & Drivers SNM54247W attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class C

Sub-Category:

Decoder/Drivers

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNM54247W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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