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SNM5447AW

Texas Instruments

SNM5447AW by Texas Instruments

SNM5447AW by Texas Instruments is a MIL-STD-883 Class C screened TTL decoder & driver with 16 terminals. It operates b/w -55°C to 125°C, with a supply voltage of 5V. This rectangular ceramic package is ideal for military applications requiring high reliability and precision.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,534 parts In-Stock

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4,534

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Digiode

USA . 923 parts In-Stock

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923

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 603 parts In-Stock

1+ parts

$8.774

100+ parts

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603

$8.774

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Parana Technologies

USA . 2,049 parts In-Stock

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$23.702

100+ parts

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$24.326

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2,049

$23.702

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$24.326

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DigiPath Technology Company

USA . 1,692 parts In-Stock

1+ parts

$26.099

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1,692

$26.099

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ChromeModa Solutions

Germany . 6,459 parts In-Stock

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$26.632

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$21.838

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6,459

$26.632

$21.838

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IDEA Electronic Components Group

UK . 1,407 parts In-Stock

1+ parts

$26.632

100+ parts

$25.300

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$23.969

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1,407

$26.632

$25.300

$23.969

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One Stop Electronics

USA . 898 parts In-Stock

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$27.000

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898

$27.000

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Corphita

USA . 3,680 parts In-Stock

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3,680

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Overview

Elevate your projects with the SNM5447AW by Texas Instruments, a top-tier manufacturer known for quality and reliability. This decoder & driver offers unmatched performance and versatility for a wide range of applications. With its MILITARY-grade temperature grade and flatpack package style, this product ensures optimal functionality in extreme conditions. Experience the benefits of seamless integration, precise decoding, and enhanced efficiency with the SNM5447AW. Upgrade your projects today with this innovative solution.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and excellent electrical insulation, making the product suitable for high-temperature environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Screening Level: MIL-STD-883 Class C

Compliance with MIL-STD-883 Class C ensures high reliability and quality standard, making it suitable for military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes the product compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended operation.

Technology: TTL

TTL technology offers fast switching speeds and high noise immunity, making the product reliable and efficient in data processing applications.

Technical Specifications

Decoder & Drivers SNM5447AW attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class C

Sub-Category:

Decoder/Drivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNM5447AW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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