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SNM54246J

Texas Instruments

SNM54246J by Texas Instruments

SNM54246J by Texas Instruments is a MIL-STD-883 Class C screened TTL decoder & driver with 16 terminals. It operates b/w -55°C to 125°C, making it suitable for military applications. The ceramic package in rectangular shape with through-hole terminals has a pitch of 2.54mm, ideal for robust electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,277 parts In-Stock

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Digiode

USA . 1,278 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,333 parts In-Stock

1+ parts

$12.732

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$13.196

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2,333

$12.732

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$13.196

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AZTECH Wire

Italy . 593 parts In-Stock

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$13.223

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593

$13.223

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DigiPath Technology Company

USA . 980 parts In-Stock

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$14.020

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980

$14.020

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ChromeModa Solutions

Germany . 3,678 parts In-Stock

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$14.306

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$11.731

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3,678

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$11.731

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IDEA Electronic Components Group

UK . 1,033 parts In-Stock

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$14.306

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$13.591

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$12.875

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$14.306

$13.591

$12.875

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One Stop Electronics

USA . 1,028 parts In-Stock

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$63.000

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Corphita

USA . 1,217 parts In-Stock

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Overview

Unlock the power of high-quality decoding and driving capabilities with the SNM54246J by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch performance and reliability in all their products. The SNM54246J is perfect for a wide range of applications, offering value and convenience to customers looking for precision and efficiency. Trust in Texas Instruments to deliver exceptional quality and innovation in every product, setting new standards in the world of decoders and drivers.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent thermal properties, making it ideal for high temperature applications.

Screening Level: MIL-STD-883 Class C

This product meets military standards for reliability and performance, ensuring quality in harsh environments.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into electronic circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand extreme heat conditions.

Minimum Operating Temperature: -55 °C

The wide range of operating temperatures allows for use in both hot and cold environments.

Temperature Grade: MILITARY

Military-grade temperature rating ensures long-term reliability and performance in demanding applications.

Technology: TTL

TTL technology offers high speed and low power consumption, making it suitable for a wide range of applications.

Technical Specifications

Decoder & Drivers SNM54246J attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class C

Sub-Category:

Decoder/Drivers

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNM54246J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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