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SNM54248W

Texas Instruments

SNM54248W by Texas Instruments

SNM54248W by Texas Instruments is a MIL-STD-883 Class C screened TTL decoder & driver with 16 terminals in a ceramic flatpack package. It operates b/w -55°C to 125°C, making it suitable for military-grade applications requiring high temperature tolerance and reliability. The surface-mount design and rectangular shape enhance its versatility in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,677 parts In-Stock

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6,677

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Digiode

USA . 2,593 parts In-Stock

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2,593

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,561 parts In-Stock

1+ parts

$18.000

100+ parts

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1,561

$18.000

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AZTECH Wire

Italy . 590 parts In-Stock

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$18.014

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590

$18.014

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Parana Technologies

USA . 2,355 parts In-Stock

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$18.782

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$18.868

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2,355

$18.782

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$18.868

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DigiPath Technology Company

USA . 1,351 parts In-Stock

1+ parts

$20.681

100+ parts

$19.026

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1,351

$20.681

$19.026

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ChromeModa Solutions

Germany . 5,938 parts In-Stock

1+ parts

$21.103

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$17.304

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5,938

$21.103

$17.304

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IDEA Electronic Components Group

UK . 860 parts In-Stock

1+ parts

$21.103

100+ parts

$20.048

1k+ parts

$18.993

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860

$21.103

$20.048

$18.993

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Corphita

USA . 3,475 parts In-Stock

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3,475

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Overview

Elevate your electronics projects with the SNM54248W by Texas Instruments. This top-quality Decoder & Drivers chip is designed to deliver reliable performance in a range of applications. With its MILITARY-grade temperature grade and durable CERAMIC package body material, this product ensures long-lasting functionality even in harsh environments. Trust in Texas Instruments' reputation for excellence and innovation, and experience the superior value and benefits that the SNM54248W brings to your designs. Upgrade your projects today and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal stability and durability, making the product suitable for harsh operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and space in the manufacturing process.

Screening Level: MIL-STD-883 Class C

Compliance with MIL-STD-883 Class C ensures high reliability and quality of the product, making it suitable for critical applications.

Package Shape: RECTANGULAR

Rectangular shape provides easy integration into existing electronic systems and allows for efficient use of space on the PCB.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures the product can function in extreme cold environments without any issues.

Technology: TTL

Use of TTL technology provides fast switching speeds and low power consumption, making the product efficient and reliable.

Technical Specifications

Decoder & Drivers SNM54248W attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class C

Sub-Category:

Decoder/Drivers

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNM54248W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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