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SNM5448J

Texas Instruments

SNM5448J by Texas Instruments

SNM5448J by Texas Instruments is a MIL-STD-883 Class C screened TTL decoder & driver with 16 terminals in an in-line package. It operates b/w -55°C to 125°C, making it suitable for military applications requiring high temperature tolerance and reliability. The ceramic package ensures durability and robust performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,999 parts In-Stock

1+ parts

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8,999

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Digiode

USA . 1,444 parts In-Stock

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1,444

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Distributors (Availability)

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AZTECH Wire

Italy . 573 parts In-Stock

1+ parts

$11.310

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573

$11.310

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Parana Technologies

USA . 1,989 parts In-Stock

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$17.919

100+ parts

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$18.086

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1,989

$17.919

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$18.086

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ChromeModa Solutions

Germany . 6,428 parts In-Stock

1+ parts

$20.134

100+ parts

$16.510

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6,428

$20.134

$16.510

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IDEA Electronic Components Group

UK . 2,234 parts In-Stock

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$20.134

100+ parts

$19.127

1k+ parts

$18.121

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2,234

$20.134

$19.127

$18.121

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One Stop Electronics

USA . 237 parts In-Stock

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$28.000

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237

$28.000

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Corphita

USA . 4,663 parts In-Stock

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4,663

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DigiPath Technology Company

USA . 1,306 parts In-Stock

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$18.153

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1,306

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$18.153

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Overview

Unlock the potential of your electronic projects with the SNM5448J by Texas Instruments. This high-quality decoder and driver offers unmatched reliability thanks to the manufacturer's renowned reputation for excellence. Ideal for military-grade applications, this product provides superior performance in a range of environments. Experience the value of precision engineering and seamless integration with the SNM5448J, setting you apart from the competition and ensuring success in your projects. Elevate your designs with this top-of-the-line component today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high mechanical strength, making the product durable and reliable.

Screening Level: MIL-STD-883 Class C

Compliance with MIL-STD-883 Class C ensures that the product has undergone stringent testing procedures, resulting in high quality and reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into various electronic systems.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting the decoder and drivers to other components, enhancing compatibility and functionality.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even under harsh environmental conditions, increasing the product's reliability.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the product to function in various temperature extremes, making it suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal position offers redundancy and enhances signal integrity, reducing the risk of signal loss or disruption in operation.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures the product can perform reliably in demanding military and aerospace applications where temperature variations are common.

Technology: TTL

TTL technology provides fast response times and low power consumption, making the product efficient and ideal for high-speed data processing.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connections, reducing the risk of signal loss or disconnection, enhancing the product's durability and reliability.

Terminal Pitch: 2.54 mm

Having a terminal pitch of 2.54 mm allows for easy soldering and integration into standardized electronic systems, making the product user-friendly and compatible with existing equipment.

Technical Specifications

Decoder & Drivers SNM5448J attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class C

Sub-Category:

Decoder/Drivers

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNM5448J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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