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SNM5448W

Texas Instruments

SNM5448W by Texas Instruments

SNM5448W by Texas Instruments is a MIL-STD-883 Class C screened TTL decoder & driver with 16 terminals in a ceramic flatpack package. It operates b/w -55°C to 125°C, making it suitable for military-grade applications requiring high temperature tolerance and reliability. The surface-mount design and rectangular shape enhance its versatility in compact electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,994 parts In-Stock

1+ parts

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3,994

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Vyrian

USA . 2,105 parts In-Stock

1+ parts

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2,105

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,412 parts In-Stock

1+ parts

$8.899

100+ parts

$826.417

1k+ parts

$8.009

10k+ parts

-

1,412

$8.899

$826.417

$8.009

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DigiPath Technology Company

USA . 454 parts In-Stock

1+ parts

$9.799

100+ parts

$9.015

1k+ parts

-

10k+ parts

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454

$9.799

$9.015

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ChromeModa Solutions

Germany . 2,326 parts In-Stock

1+ parts

$9.999

100+ parts

$8.199

1k+ parts

-

10k+ parts

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2,326

$9.999

$8.199

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IDEA Electronic Components Group

UK . 810 parts In-Stock

1+ parts

$9.999

100+ parts

$9.499

1k+ parts

$8.999

10k+ parts

-

810

$9.999

$9.499

$8.999

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AZTECH Wire

Italy . 347 parts In-Stock

1+ parts

$11.704

100+ parts

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347

$11.704

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One Stop Electronics

USA . 815 parts In-Stock

1+ parts

$17.000

100+ parts

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815

$17.000

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Corphita

USA . 323 parts In-Stock

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323

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Overview

Upgrade your electronic projects with the SNM5448W by Texas Instruments, a high-quality decoder and driver that offers exceptional performance and reliability. Manufactured by the trusted brand Texas Instruments, this product is designed for military-grade applications, ensuring durability and precision in extreme conditions. With its ceramic package body material and flatpack style, the SNM5448W is perfect for surface mount installations. Trust in Texas Instruments to deliver innovative technology that exceeds expectations. Elevate your projects with the SNM5448W today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity, which helps in dissipating heat efficiently during operation, making this product suitable for high temperature applications.

Surface Mount: YES

Surface mount technology allows for compact size, easy assembly, and reliable connections, making this product convenient for modern electronic designs.

Screening Level: MIL-STD-883 Class C

With MIL-STD-883 Class C screening level, this product ensures high reliability and performance under extreme conditions, making it a dependable choice for critical applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that this product can withstand elevated temperatures without compromising its functionality, making it suitable for harsh environments.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making this product efficient and ideal for applications where speed and power efficiency are essential.

Technical Specifications

Decoder & Drivers SNM5448W attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class C

Sub-Category:

Decoder/Drivers

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNM5448W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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