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SN74LS139N-00

Texas Instruments

SN74LS139N-00 by Texas Instruments

SN74LS139N-00 by Texas Instruments is a TTL decoder with 2 functions, 16 terminals, and 38 ns propagation delay. It operates at a supply voltage range of 4.75V to 5.25V and has inverted output polarity. This IC is commonly used in commercial applications requiring fast decoding capabilities within the temperature range of 0°C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,113 parts In-Stock

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Vyrian

USA . 2,966 parts In-Stock

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2,966

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 339 parts In-Stock

1+ parts

$18.552

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339

$18.552

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Parana Technologies

USA . 1,394 parts In-Stock

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$27.934

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-

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$41.814

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1,394

$27.934

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$41.814

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ChromeModa Solutions

Germany . 5,584 parts In-Stock

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$31.386

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$25.737

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5,584

$31.386

$25.737

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IDEA Electronic Components Group

UK . 1,183 parts In-Stock

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$31.386

100+ parts

$29.817

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$28.247

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1,183

$31.386

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$28.247

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One Stop Electronics

USA . 1,180 parts In-Stock

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$57.000

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$57.000

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DigiPath Technology Company

USA . 2,361 parts In-Stock

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$28.298

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2,361

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Corphita

USA . 161 parts In-Stock

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Overview

Unleash the power of reliable decoding and driving with the SN74LS139N-00 by Texas Instruments. Crafted with precision and expertise, this decoder & driver offers unmatched quality and performance for a wide range of applications. With a nominal supply voltage of 5V and a low propagation delay of just 38ns, this product ensures efficient and seamless operation. Trust Texas Instruments to deliver excellence in every package - literally, as the PLASTIC/EPOXY body material guarantees durability. Elevate your projects with the SN74LS139N-00 and experience the value of top-tier technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material for the package body provides durability and protection for the internal components of the decoder & drivers, ensuring long-term reliability.

No. of Functions: 2

With two functions available in one device, this decoder & drivers product offers flexibility and efficiency in circuit designs.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easier to integrate this product into various applications.

Propagation Delay (tpd): 38 ns

The low propagation delay of 38ns allows for fast processing of signals, making this decoder & drivers suitable for time-sensitive applications.

Technology: TTL

Being based on TTL technology, this product offers reliable logic control for decoding and driving signals in digital circuits.

Technical Specifications

Decoder & Drivers SN74LS139N-00 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Load Capacitance (CL):

15 pF

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

11 mA

Propagation Delay (tpd):

38 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74LS139N-00 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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