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SNJ55463JG

Texas Instruments

SNJ55463JG by Texas Instruments

SNJ55463JG by Texas Instruments is a MILITARY-grade OR GATE BASED PERIPHERAL DRIVER with 2 functions, operating at 4.5-5.5V. It has OPEN-COLLECTOR output and can handle up to 0.5A peak current flow, suitable for military applications requiring fast turn-on/off times and high supply voltage tolerance.

Median Price

$8.960

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 230 parts In-Stock

1+ parts

$8.960

100+ parts

$3.882

1k+ parts

$3.674

10k+ parts

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230

$8.960

$3.882

$3.674

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Vyrian

USA . 7,209 parts In-Stock

1+ parts

-

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7,209

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Digiode

USA . 2,536 parts In-Stock

1+ parts

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2,536

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Mil-Aero Solutions, Inc.

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,623 parts In-Stock

1+ parts

$11.258

100+ parts

-

1k+ parts

$11.695

10k+ parts

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1,623

$11.258

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$11.695

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$11.819

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292

$11.819

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ChromeModa Solutions

Germany . 2,024 parts In-Stock

1+ parts

$12.650

100+ parts

$10.373

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2,024

$12.650

$10.373

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IDEA Electronic Components Group

UK . 102 parts In-Stock

1+ parts

$12.650

100+ parts

$12.018

1k+ parts

$11.385

10k+ parts

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102

$12.650

$12.018

$11.385

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One Stop Electronics

USA . 1,113 parts In-Stock

1+ parts

$44.500

100+ parts

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1,113

$44.500

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A-Z Elektronik GmbH

Germany . 4,880 parts In-Stock

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4,880

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DigiPath Technology Company

USA . 2,245 parts In-Stock

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$11.405

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2,245

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$11.405

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Corphita

USA . 863 parts In-Stock

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863

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Kepictronics

USA . 162 parts In-Stock

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162

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Overview

Enhance your electronic projects with the SNJ55463JG by Texas Instruments. Crafted with precision and expertise, this peripheral driver boasts superior quality and reliability. Perfect for a wide range of applications, this MILITARY-grade component offers seamless integration and optimal performance. With its dual functions and OR GATE BASED design, customers can trust in its efficiency and durability. Upgrade your projects today with the SNJ55463JG and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable and reliable package body material ensures the long-term functionality and stability of the peripheral driver.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of power inputs without risk of damage.

No. of Functions: 2

Having multiple functions in a single peripheral driver adds versatility and efficiency to the user's circuit design.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic systems and layouts.

Temperature Grade: MILITARY

This peripheral driver is designed to meet military-grade standards, ensuring reliability and performance in harsh environments.

Input Characteristics: STANDARD

The standard input characteristics make it compatible with a wide range of devices and systems, enhancing its usability.

Nominal Output Peak Current Limit: 0.5 A

The high peak output current limit ensures that the peripheral driver can handle high-power devices and components effectively.

Interface IC Type: OR GATE BASED PERIPHERAL DRIVER

The OR gate based interface IC type offers versatile and efficient operation in various circuit configurations.

Output Current Flow Direction: SINK

The sink output current flow direction ensures compatibility with a wide range of devices, making it a versatile choice for different applications.

Technical Specifications

Peripheral Drivers SNJ55463JG attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-CDIP-T8

Length:

9.6 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Current:

76 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

.055 us

Turn-on Time:

.04 us

Width:

7.62 mm

Trade Compliance

SNJ55463JG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-187-9291, 5962011879291, 5962-01-125-2233, 5962011252233, 5962-01-119-7549, 5962011197549, 5962-01-243-5961, 5962012435961

NIIN

011879291, 011252233, 011197549, 012435961

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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